Title:
LOW-MELTING-POINT GLASS
Document Type and Number:
WIPO Patent Application WO/2022/050237
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide glass that has a low Tg, allowing for low-temperature molding, and in which bubbling and crystallization during molding are suppressed. The present invention pertains to glass that contains, indicated in mol% of the elements, 8-25% P, 8-40% Sn, 20-80% O, and 1-50% F, the glass transition temperature Tg being 300°C or lower, and A3240/A3100 being 1.2 or below, where A3100 is the absorbance per 1 mm thickness at the wavenumber 3100 cm-1, and A3240 is the absorbance per 1 mm thickness at the wavenumber 3240 cm-1, in the infrared absorption spectrum.
Inventors:
WADA NAOYA (JP)
TOMENO SATORU (JP)
INAMOTO MISA (JP)
TOMENO SATORU (JP)
INAMOTO MISA (JP)
Application Number:
PCT/JP2021/031794
Publication Date:
March 10, 2022
Filing Date:
August 30, 2021
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
C03C3/247; B32B17/10; C08J3/12
Domestic Patent References:
| WO2008146886A1 | 2008-12-04 |
Foreign References:
| JP2016502246A | 2016-01-21 | |||
| JP2011513916A | 2011-04-28 | |||
| JPH04231349A | 1992-08-20 | |||
| JPH02225334A | 1990-09-07 | |||
| JP2001048575A | 2001-02-20 | |||
| US20190074476A1 | 2019-03-07 | |||
| JPH03140337A | 1991-06-14 | |||
| JP2005289793A | 2005-10-20 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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