Title:
LOW-MELTING-POINT INORGANIC BINDER SUITABLE FOR ALUMINUM SUBSTRATE AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/103165
Kind Code:
A1
Abstract:
A low-melting-point inorganic binder suitable for an aluminum substrate and a preparation method therefor. The low-melting-point inorganic binder comprises the following materials in parts by weight: SiO2: 1％-20％; Bi2O3: 30％-50％; B2O3: 5％-40％; CaF2: 5％-15％; SnO2: 0.1％-2％; Al2O3: 0.2％-15％; ZnO: 0.1％-5％; and TiO2: 0.1％-2％. The low-melting-point inorganic binder has a low softening point and a moderate melting temperature, as well as excellent dielectric property and physical and chemical properties, and can effectively meet requirements for an insulating medium of an aluminum substrate and an inorganic binder of electronic slurry. The preparation method comprises the following process steps: a) weighting and stirring; b) heating and melting; c) water quenching; d) drying; and e) grinding and ball milling. By means of the design of the process steps above, the preparation method can effectively produce and prepare the low-melting-point inorganic binder.
Inventors:
LIU JIAN (CN)
SU GUANXIAN (CN)
SU GUANXIAN (CN)
Application Number:
PCT/CN2016/113349
Publication Date:
June 14, 2018
Filing Date:
December 30, 2016
Export Citation:
Assignee:
DONGGUAN COREHELM ELECTRONIC MAT CO LTD (CN)
International Classes:
C03C12/00; C03C8/24
Foreign References:
| CN105225723A | 2016-01-06 | |||
| CN1572744A | 2005-02-02 | |||
| CN101164939A | 2008-04-23 | |||
| JP2011079718A | 2011-04-21 | |||
| CN104966546A | 2015-10-07 | |||
| CN104692663A | 2015-06-10 |
Attorney, Agent or Firm:
SHENZHEN TALENT PATENT SERVICE (CN)
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