Title:
LOW-MODULUS DIE ATTACH FILM ADHESIVE FOR VERTICALLY STACKED PACKAGE, PREPARATION METHOD THEREFOR AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2024/066254
Kind Code:
A1
Abstract:
Disclosed are a low-modulus die attach film adhesive for a vertically stacked package, a preparation method therefor and an application thereof. The die attach film adhesive comprises the following raw materials: 2-5 parts by mass of silicon dioxide, 15-25 parts by mass of an acrylic epoxy resin, 5-15 parts by mass of a flexible liquid epoxy resin, 4-6 parts by mass of a phenolic solid curing agent, 5-9 parts by mass of a phenolic liquid curing agent, 0-2 parts by mass of a polymer silane coupling agent, 0-2 parts by mass of a silicone rubber alloy, and 0.27-0.32 parts by mass of an accelerant. The die attach film adhesive of the present invention has low storage modulus, high glass transition temperature, high film tensile strength, low thermal expansion coefficient, low moisture absorption rate and high silicon wafer adhesion, meets the requirements of a multi-chip stacked package for a die attach film adhesive, and is suitable for multi-chip stacked packages.
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Inventors:
WU DE (CN)
LI TING (CN)
LIAO SHUHANG (CN)
SU JUNXING (CN)
LI TING (CN)
LIAO SHUHANG (CN)
SU JUNXING (CN)
Application Number:
PCT/CN2023/084225
Publication Date:
April 04, 2024
Filing Date:
March 28, 2023
Export Citation:
Assignee:
WUHAN CHOICE TECH CO LTD (CN)
International Classes:
C09J163/10; C09J7/10; C09J7/30; C09J11/04; C09J163/00; C09J183/04; H01L33/56
Domestic Patent References:
| WO2022151517A1 | 2022-07-21 |
Foreign References:
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Other References:
WANG, DAGANG: "A Brief Discussion on the Research on Toughening Modification of Epoxy Resin", ZHONG-XIAO QIYE GUANLI YU KEJI - MANAGEMENT & TECHNOLOGY OF SME, HEBEI SHENG ZHONGXIAO QIYE FUWU ZHONGXIN, CN, no. 05, 5 May 2009 (2009-05-05), CN , pages 287, XP009553469, ISSN: 1673-1069
Attorney, Agent or Firm:
ZHONGLIHE LAW FIRM et al. (CN)
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