Title:
LOW STRESS THERMOELECTRIC MODULE
Document Type and Number:
WIPO Patent Application WO/2017/123661
Kind Code:
A3
Abstract:
Applicants have identified four methods to minimize the stress in the module and thereby minimize the warping the module experiences during the fabrication process. These include: breaking up the slab, thin plastic between elements, use of Bridgeman cast legs, and soldering the cold side. The primary cost driver of thermoelectric modules is the costs associated with the N and P thermoelectric material needed to make the N and P thermoelectric legs of the module. Preferred embodiments designed by applicants utilize legs that require only a small fraction of the thermoelectric material compared to typical prior art thermoelectric modules with only a slight decrease in efficiencies. These smaller legs result in projected high-volume module costs of less than $1.00 per watt.
Inventors:
LEAVITT FREDERICK A (US)
Application Number:
PCT/US2017/013053
Publication Date:
October 19, 2017
Filing Date:
January 11, 2017
Export Citation:
Assignee:
HI-Z TECH INC (US)
International Classes:
H01L35/32; H01L35/02; H01L35/34
Foreign References:
| US20120103381A1 | 2012-05-03 | |||
| US20140137918A1 | 2014-05-22 | |||
| US20100024437A1 | 2010-02-04 | |||
| US20100243018A1 | 2010-09-30 | |||
| US5892656A | 1999-04-06 | |||
| US5982013A | 1999-11-09 | |||
| US6314741B1 | 2001-11-13 |
Attorney, Agent or Firm:
ROSS, John, R., III et al. (US)
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