Title:
LOW-TEMPERATURE CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/002301
Kind Code:
A1
Abstract:
A low-temperature curable composition which contains (A) at least one curable component that is selected from among epoxy resins and blocked isocyanates and (B) an amine-based latent curing agent, wherein the peak of the reaction temperature of the amine-based latent curing agent (B) with a bisphenol A epoxy resin is between 70°C and 110°C.
Inventors:
NISHIDA TAKATOMI (JP)
HANASAKI KAZUAKI (JP)
MINAMIHORI TAKASHI (JP)
HANASAKI KAZUAKI (JP)
MINAMIHORI TAKASHI (JP)
Application Number:
PCT/JP2020/025343
Publication Date:
January 07, 2021
Filing Date:
June 26, 2020
Export Citation:
Assignee:
SUNSTAR ENGINEERING INC (JP)
International Classes:
C08G59/50; C08G18/32; C08G18/80
Domestic Patent References:
| WO2019039230A1 | 2019-02-28 |
Foreign References:
| JP2018184525A | 2018-11-22 | |||
| JP2010031140A | 2010-02-12 | |||
| JP2019123924A | 2019-07-25 |
Other References:
See also references of EP 3995523A4
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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