Title:
LOW-TEMPERATURE HEAT-CURABLE ADHESIVE COMPOSITION FOR STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/180955
Kind Code:
A1
Abstract:
Provided are: a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects caused by open-state standing, and is excellent in terms of rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition.
The low-temperature heat-curable adhesive composition for structures comprises (A) an epoxy resin, (B) a microencapsulated hardener, (C) a moisture absorbent, (D) a viscosity modifier, and (E) a stabilizer. The moisture absorbent (C) is calcium oxide, which preferably comprises both a surface-treated grade and a non-surface-treated grade.
Inventors:
MAKINO DAISUKE (JP)
SUZUKI ATSUHIKO (JP)
MURACHI YUSUKE (JP)
ASAKAWA MOTOYASU (JP)
HIMURO YUYA (JP)
YAMAMOTO KENICHI (JP)
SUZUKI ATSUHIKO (JP)
MURACHI YUSUKE (JP)
ASAKAWA MOTOYASU (JP)
HIMURO YUYA (JP)
YAMAMOTO KENICHI (JP)
Application Number:
PCT/JP2018/011607
Publication Date:
October 04, 2018
Filing Date:
March 23, 2018
Export Citation:
Assignee:
CEMEDINE CO LTD (JP)
MAZDA MOTOR (JP)
MAZDA MOTOR (JP)
International Classes:
C09J163/00; B62D65/00; C09J11/04; C09J11/06
Domestic Patent References:
| WO2014103552A1 | 2014-07-03 |
Foreign References:
| JP2015518065A | 2015-06-25 | |||
| JP2013535523A | 2013-09-12 | |||
| JP2011148869A | 2011-08-04 | |||
| JPH0488077A | 1992-03-19 | |||
| JP2010189542A | 2010-09-02 | |||
| JP2010523800A | 2010-07-15 |
Attorney, Agent or Firm:
ISHIHARA, Shinsuke et al. (JP)
Download PDF: