Title:
LOW-TEMPERATURE-SINTERABLE BONDING MATERIAL, AND BONDING METHOD USING THE BONDING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2011/155615
Kind Code:
A1
Abstract:
Disclosed is a bonding material which enables the formation of a bonded article in a nitrogen atmosphere, can exhibit practically effective bonding strength without the need of carrying out any heat treatment procedure under pressurized or high-temperature conditions, and has reduced fluctuation in bonding between samples. The bonding material comprises: silver nanoparticles which have an average primary particle diameter of 1 to 200 nm and are coated with an organic substance having 8 or less carbon atoms; and a flux component which comprises a dispersion medium having a boiling point of 203°C or higher and an organic substance having at least two carboxyl groups. Particularly preferably, a combination of silver nanoparticles and submicron silver particles is used.
Inventors:
ENDOH Keiichi (14-1, Soto-Kanda 4-chome, Chiyoda-k, Tokyo 21, 〒1010021, JP)
遠藤 圭一 (〒21 東京都千代田区外神田四丁目１４番１号 ＤＯＷＡエレクトロニクス株式会社内 Tokyo, 〒1010021, JP)
HISAEDA Yutaka (14-1, Soto-Kanda 4-chome, Chiyoda-k, Tokyo 21, 〒1010021, JP)
久枝 穣 (〒21 東京都千代田区外神田四丁目１４番１号 ＤＯＷＡエレクトロニクス株式会社内 Tokyo, 〒1010021, JP)
MIYAZAWA Akihiro (14-1, Soto-Kanda 4-chome, Chiyoda-k, Tokyo 21, 〒1010021, JP)
遠藤 圭一 (〒21 東京都千代田区外神田四丁目１４番１号 ＤＯＷＡエレクトロニクス株式会社内 Tokyo, 〒1010021, JP)
HISAEDA Yutaka (14-1, Soto-Kanda 4-chome, Chiyoda-k, Tokyo 21, 〒1010021, JP)
久枝 穣 (〒21 東京都千代田区外神田四丁目１４番１号 ＤＯＷＡエレクトロニクス株式会社内 Tokyo, 〒1010021, JP)
MIYAZAWA Akihiro (14-1, Soto-Kanda 4-chome, Chiyoda-k, Tokyo 21, 〒1010021, JP)
Application Number:
JP2011/063418
Publication Date:
December 15, 2011
Filing Date:
June 10, 2011
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO., LTD. (14-1, Soto-Kanda 4-chome Chiyoda-k, Tokyo 21, 〒1010021, JP)
ＤＯＷＡエレクトロニクス株式会社 (〒21 東京都千代田区外神田四丁目１４番１号 Tokyo, 〒1010021, JP)
ENDOH Keiichi (14-1, Soto-Kanda 4-chome, Chiyoda-k, Tokyo 21, 〒1010021, JP)
遠藤 圭一 (〒21 東京都千代田区外神田四丁目１４番１号 ＤＯＷＡエレクトロニクス株式会社内 Tokyo, 〒1010021, JP)
HISAEDA Yutaka (14-1, Soto-Kanda 4-chome, Chiyoda-k, Tokyo 21, 〒1010021, JP)
久枝 穣 (〒21 東京都千代田区外神田四丁目１４番１号 ＤＯＷＡエレクトロニクス株式会社内 Tokyo, 〒1010021, JP)
ＤＯＷＡエレクトロニクス株式会社 (〒21 東京都千代田区外神田四丁目１４番１号 Tokyo, 〒1010021, JP)
ENDOH Keiichi (14-1, Soto-Kanda 4-chome, Chiyoda-k, Tokyo 21, 〒1010021, JP)
遠藤 圭一 (〒21 東京都千代田区外神田四丁目１４番１号 ＤＯＷＡエレクトロニクス株式会社内 Tokyo, 〒1010021, JP)
HISAEDA Yutaka (14-1, Soto-Kanda 4-chome, Chiyoda-k, Tokyo 21, 〒1010021, JP)
久枝 穣 (〒21 東京都千代田区外神田四丁目１４番１号 ＤＯＷＡエレクトロニクス株式会社内 Tokyo, 〒1010021, JP)
International Classes:
B22F9/00; B22F1/00; B22F1/02; H01B1/00; H01B1/22; H01L21/52; H05K3/32
Attorney, Agent or Firm:
HIROKOH Masaki (Tatsuno Nishi-Tenma Bldg, 1-6 Nishi-Tenma 3-chome, Kita-ku, Osaka-sh, Osaka 47, 〒5300047, JP)
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