Title:
LOW-TEMPERATURE-SINTERABLE COPPER PARTICLE AND METHOD FOR MANUFACTURING SINTERED COMPACT USING SAME
Document Type and Number:
WIPO Patent Application WO/2019/106739
Kind Code:
A1
Abstract:
Provided are a novel low-temperature-sinterable copper particle that can be sintered even at a low temperature of about 100°C or less, for example, and a method for manufacturing a sintered compact using the same. This low-temperature-sinterable copper particle is coated by a carboxylic acid, and the surface thereof is oxidized so that the cuprous oxide fraction (Cu2O/(Cu + Cu2O) in the copper particle is 4% by mass or less, or the average coating thickness of cuprous oxide is 10 nm or less. The low-temperature-sinterable copper particles are low-temperature sintered in an atmosphere having a pressure of 0.01 Pa or less.
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Inventors:
YONEZAWA TETSU (JP)
TSUKAMOTO HIROKI (JP)
TSUKAMOTO HIROKI (JP)
Application Number:
PCT/JP2017/042742
Publication Date:
June 06, 2019
Filing Date:
November 29, 2017
Export Citation:
Assignee:
UNIV HOKKAIDO NAT UNIV CORP (JP)
International Classes:
B22F1/00; B22F1/02
Domestic Patent References:
| WO2016031860A1 | 2016-03-03 |
Foreign References:
| JP2016069716A | 2016-05-09 | |||
| JP2015214722A | 2015-12-03 | |||
| JP2017001978A | 2017-01-05 | |||
| JP2016176146A | 2016-10-06 | |||
| JPS6033485B2 | 1985-08-03 |
Other References:
J. ELECTRON. MATER., vol. 42, no. 6, 2013, pages 1260 - 1267
See also references of EP 3718661A4
See also references of EP 3718661A4
Attorney, Agent or Firm:
NISHIZAWA Toshio (JP)
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