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Title:
LOW-TEMPERATURE SINTERABLE SILVER NANOPARTICLE COMPOSITION AND ELECTRONIC COMPONENT FORMED USING THAT COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2012/026033
Kind Code:
A1
Abstract:
Provided is a silver nanoparticle composition, which is sintered in a short time at low temperatures, has excellent adherence with a substrate, and can construct silver conductive films and wiring that have low resistance. Also provided is a component using the same. The silver nanoparticle composition provided is characterized by the principal component of the solvent being water, the pH of the composition being in a range of 5.3 - 8.0, the silver nanoparticles contained in that composition being protected by organic acids or derivatives thereof, and the content for these organic acids or derivatives thereof being in a range of 2 - 20% by mass of the silver.

Inventors:
JABLONSKI GREGORY A (US)
MASTROPIETRO MICHAEL A (US)
SATO KIMITAKA (JP)
MIYOSHI HIROMASA (JP)
FUJITA HIDEFUMI (JP)
Application Number:
PCT/JP2010/064556
Publication Date:
March 01, 2012
Filing Date:
August 27, 2010
Export Citation:
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Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
PCHEM ASSOCIATES INC (US)
JABLONSKI GREGORY A (US)
MASTROPIETRO MICHAEL A (US)
SATO KIMITAKA (JP)
MIYOSHI HIROMASA (JP)
FUJITA HIDEFUMI (JP)
International Classes:
B22F9/00; B22F1/00; B22F1/0545; B22F1/102
Domestic Patent References:
WO2008048316A22008-04-24
Foreign References:
JP2009521598A2009-06-04
JP2009161808A2009-07-23
JP2010116625A2010-05-27
JP2010080442A2010-04-08
JP2010512653A2010-04-22
JP2005200604A2005-07-28
JP2005310703A2005-11-04
Other References:
See also references of EP 2610023A4
Attorney, Agent or Firm:
HIROKOH, MASAKI (JP)
Hiroyuki Masaki (JP)
Download PDF:
Claims: