Title:
LOW-TEMPERATURE-SINTERING BONDING MATERIAL AND BONDING METHOD USING THE BONDING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2011/155055
Kind Code:
A1
Abstract:
Disclosed is a bonding material which can form a bonded article even in a nitrogen atmosphere, can exhibit practically effective bonding strength without the need of any thermal treatment procedure under pressurized or high-temperature conditions, and undergoes a reduced degree of bonding fluctuation among samples.
The bonding material comprises: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic substance having 8 or less carbon atoms; and a dispersion medium having a boiling point of 230˚C or higher. Particularly preferably, a combination of silver nanoparticles and micron silver particles is used.
Inventors:
ENDOH KEIICHI (JP)
HISAEDA YUTAKA (JP)
MIYAZAWA AKIHIRO (JP)
NAGAHARA AIKO (JP)
UEYAMA TOSHIHIKO (JP)
HISAEDA YUTAKA (JP)
MIYAZAWA AKIHIRO (JP)
NAGAHARA AIKO (JP)
UEYAMA TOSHIHIKO (JP)
Application Number:
PCT/JP2010/059921
Publication Date:
December 15, 2011
Filing Date:
June 11, 2010
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
ENDOH KEIICHI (JP)
HISAEDA YUTAKA (JP)
MIYAZAWA AKIHIRO (JP)
NAGAHARA AIKO (JP)
UEYAMA TOSHIHIKO (JP)
ENDOH KEIICHI (JP)
HISAEDA YUTAKA (JP)
MIYAZAWA AKIHIRO (JP)
NAGAHARA AIKO (JP)
UEYAMA TOSHIHIKO (JP)
International Classes:
B22F9/00; B22F1/00; B22F1/054; B22F1/102; H01L21/52; H05K3/32
Domestic Patent References:
WO2009116185A1 | 2009-09-24 | |||
WO2005025787A1 | 2005-03-24 |
Foreign References:
JP2006241494A | 2006-09-14 | |||
JP2007042301A | 2007-02-15 | |||
JP2009007593A | 2009-01-15 | |||
JP2007095525A | 2007-04-12 | |||
JP2010080438A | 2010-04-08 |
Attorney, Agent or Firm:
HIROKOH, MASAKI (JP)
Hiroyuki Masaki (JP)
Hiroyuki Masaki (JP)
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Claims: