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Patent Searching and Data


Title:
LOW-TEMPERATURE-SINTERING BONDING MATERIAL AND BONDING METHOD USING THE BONDING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2011/155055
Kind Code:
A1
Abstract:
Disclosed is a bonding material which can form a bonded article even in a nitrogen atmosphere, can exhibit practically effective bonding strength without the need of any thermal treatment procedure under pressurized or high-temperature conditions, and undergoes a reduced degree of bonding fluctuation among samples. The bonding material comprises: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic substance having 8 or less carbon atoms; and a dispersion medium having a boiling point of 230˚C or higher. Particularly preferably, a combination of silver nanoparticles and micron silver particles is used.

Inventors:
ENDOH KEIICHI (JP)
HISAEDA YUTAKA (JP)
MIYAZAWA AKIHIRO (JP)
NAGAHARA AIKO (JP)
UEYAMA TOSHIHIKO (JP)
Application Number:
PCT/JP2010/059921
Publication Date:
December 15, 2011
Filing Date:
June 11, 2010
Export Citation:
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Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
ENDOH KEIICHI (JP)
HISAEDA YUTAKA (JP)
MIYAZAWA AKIHIRO (JP)
NAGAHARA AIKO (JP)
UEYAMA TOSHIHIKO (JP)
International Classes:
B22F9/00; B22F1/00; B22F1/054; B22F1/102; H01L21/52; H05K3/32
Domestic Patent References:
WO2009116185A12009-09-24
WO2005025787A12005-03-24
Foreign References:
JP2006241494A2006-09-14
JP2007042301A2007-02-15
JP2009007593A2009-01-15
JP2007095525A2007-04-12
JP2010080438A2010-04-08
Attorney, Agent or Firm:
HIROKOH, MASAKI (JP)
Hiroyuki Masaki (JP)
Download PDF:
Claims: