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Patent Searching and Data


Title:
LOW TEMPERATURE SINTERING CONDUCTIVE METAL FILM AND PREPARATION METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2012/074200
Kind Code:
A3
Abstract:
The present invention relates to a low temperature sintering conductive metal ink and a preparation method thereof. More specifically, the invention provides a method for preparing a conductive metal film or pattern, which comprises: (step 1) preparing the conductive film or pattern and metal nanocolloids, prepared by printing a conductive metal ink comprising metal nanocolloids, metal salts, and polymers causing a reaction with the metal salts; (step 2) preparing a mixture by mixing the metal salts with polymers; (step 3) preparing a metal ink by mixing metal nanocolloids prepared in step 1 with a metal salt/polymer mixture prepared in step 2; (step 4) printing the metal ink prepared in step 3; and (step 5) drying and heat-treating a printed material of step 4.

Inventors:
YU JI-HUN (KR)
YANG SANGSUN (KR)
KIM YONG-JIN (KR)
Application Number:
PCT/KR2011/007841
Publication Date:
July 26, 2012
Filing Date:
October 20, 2011
Export Citation:
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Assignee:
KOREA MACH & MATERIALS INST (KR)
YU JI-HUN (KR)
YANG SANGSUN (KR)
KIM YONG-JIN (KR)
International Classes:
B22F7/02; B22F1/0545; B22F3/10; B22F9/02; B22F1/105; B22F1/107
Foreign References:
KR20060012545A2006-02-08
JPH0377202A1991-04-02
KR20090131454A2009-12-29
KR20000075549A2000-12-15
Attorney, Agent or Firm:
LEE, Won Hee (642-16 Yoksam-dongKangnam-ku, Seoul 135-080, KR)
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Claims: