LOW-TEMPERATURE SOLDER, METHOD FOR PRODUCING LOW-TEMPERATURE SOLDER, AND LOW-TEMPERATURE SOLDER COATED LEAD WIRE

Title:

LOW-TEMPERATURE SOLDER, METHOD FOR PRODUCING LOW-TEMPERATURE SOLDER, AND LOW-TEMPERATURE SOLDER COATED LEAD WIRE

Document Type and Number:

WIPO Patent Application WO/2022/070910

Kind Code:

A1

Abstract:

[Purpose] The present invention relates to a low-temperature solder, a method for producing a low-temperature solder, and a low-temperature solder coated lead wire; and the purpose of the present invention is to provide a low-temperature solder which is formed of an alloy of Sn and Bi, or an alloy of Sn, Bi and In or the like, and which is capable of soldering an electrode (of aluminum, copper or the like) on a resin film by being mixed with one or more elements selected from among Al, P, Sb, In and the like so as to be melted and alloyed, while being obtained at a low cost. [Constitution] A low-temperature solder which is obtained by mixing a base material that is an alloy of Sn and Bi or In, or an alloy of Sn, Bi and In, with not more than 3 wt% in toatl, preferably not more than 1.0 wt% or 1.5 wt% but not less than 0.01 wt% in total of a main material that is composed of one or more elements that are selected from among Al, P, Sb, and In (excluding the cases wherein In is contained in the base material) so as to be melted and alloyed, thereby enhancing the adhesive power.

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Inventors:

OKADA MORIHIRO (JP)
ARAI TAKASHI (JP)
ARAI KATSUYA (JP)
ARAI HIROAKI (JP)
SUGAWARA MIEKO (JP)
KOBAYASHI KENICHI (JP)
KOMIYA HIDETOSHI (JP)
MATSUI SHOGO (JP)
NISHIGORI JUN (JP)
MORI NAOHISA (JP)
TOKUDA RYO (JP)

Application Number:

PCT/JP2021/033865

Publication Date:

April 07, 2022

Filing Date:

September 15, 2021

Export Citation:

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Assignee:

ARTBEAM CO LTD (JP)
OKADA MORIHIRO (JP)

International Classes:

C22C12/00; B23K35/26; C22C13/00; C22C28/00; C22C30/04; H05K1/03

Domestic Patent References:

WO2015019966A1

2015-02-12

Foreign References:

JP2016026884A	2016-02-18
JP2013248664A	2013-12-12
JP2000141079A	2000-05-23
JP2019527145A	2019-09-26
JP2010167472A	2010-08-05

Attorney, Agent or Firm:

OKADA Morihiro (JP)

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