Title:
LOW THERMAL EXPANSION ALLOY
Document Type and Number:
WIPO Patent Application WO/2018/186417
Kind Code:
A1
Abstract:
Provided is a low thermal expansion alloy which is highly rigid and has a low coefficient of thermal expansion, and which is characterized in that the alloy contains, in terms of mass%, 0.040% or less of C, 0.25% or less of Si, 0.15-0.50% of Mn, 8.50-10.0% of Cr, 0-5.00% of Ni, 43.0-56.0% of Co, 0-0.050% of S and 0-0.050% of Se, with the remainder comprising Fe and unavoidable impurities, the content values of Ni, Co and Mn ([Ni], [Co] and [Mn]) satisfy the relationship 55.7 ≤ 2.2[Ni]+[Co]+1.7[Mn] ≤ 56.7, and the structure of the alloy is an austenite single phase.
Inventors:
SAKAGUCHI NAOKI (JP)
OHNO HARUYASU (JP)
OHNO HARUYASU (JP)
Application Number:
PCT/JP2018/014319
Publication Date:
October 11, 2018
Filing Date:
April 03, 2018
Export Citation:
Assignee:
SHINHOKOKU STEEL CORP (JP)
International Classes:
C22C19/07; C22C30/00; C22F1/10; C22F1/00
Foreign References:
| JP2002088432A | 2002-03-27 | |||
| JP2004204255A | 2004-07-22 | |||
| JP2011074454A | 2011-04-14 | |||
| JP2003081648A | 2003-03-19 | |||
| JP2009227180A | 2009-10-08 |
Other References:
See also references of EP 3608431A4
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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