LOW THERMAL EXPANSION ALLOY - SHINHOKOKU MAT CORP

Title:

LOW THERMAL EXPANSION ALLOY

Document Type and Number:

WIPO Patent Application WO/2024/014484

Kind Code:

A1

Abstract:

The present invention addresses the problem of obtaining a low thermal expansion alloy having improved machinability. A low thermal expansion alloy according to the present invention contains, in terms of mass%, at most 0.050% of C, 0.30-1.00% of Si, 0.50-2.00% of Mn, 0.030-0.150% of S, 27.00-38.00% of Ni, 0-12.00% of Co, 0.003-0.100% of sol. Al, and at most 0.010% of O, with the remainder consisting of Fe and impurities, wherein [Mn], [S], [Ni], [Co], and [Si], which are the contents of Mn, S, Ni, Co, and Si expressed as mass%, satisfy [Mn]/[S]≥10.0, 32.0%≤[Ni]+0.4[Co]≤38.0%, and [Si]+[Mn]≤2.50%, and the average thermal expansion coefficient at 25-100ºC is at most 3.0×10-6/ºC.

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Inventors:

MATSUMURA SHINGO (JP)
OHNO HARUYASU (JP)
ONA KOTARO (JP)

Application Number:

PCT/JP2023/025751

Publication Date:

January 18, 2024

Filing Date:

July 12, 2023

Export Citation:

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Assignee:

SHINHOKOKU MAT CORP (JP)

International Classes:

C21D8/00; C22C38/00; C21D9/00; C22C30/00; C22C38/60; C22F1/00; C22F1/16

Foreign References:

JP2018145491A	2018-09-20
JP2018165380A	2018-10-25
JP2019065344A	2019-04-25
JP2003286546A	2003-10-10
JP2001262277A	2001-09-26
JP2012530001A	2012-11-29