LOWER ELECTRODE DEVICE AND PLASMA SYSTEM

WIPO Patent Application WO/2020/253514

A1

A lower electrode device and a plasma system. The lower electrode device is used in a plasma system (1), and comprises: a lower electrode (11), and annular electrodes (21A, 21 B and 21 C) arranged around the lower electrode (11), and a radio-frequency source (12) coupled to the lower electrode (11), the lower electrode device further comprises an electric field regulating circuit (14), one end of the electric field regulating circuit (14) being coupled to the annular electrodes (21A, 21B and 21C), the other end of the electric field regulating circuit (14) being coupled to a grounding end (15), the electric field regulating circuit (14) being used to regulate an electric field distribution close to the edge of a workpiece which is to be machined and placed on the lower electrode (11), thereby regulating the bending of a plasma sheath at the edge of said workpiece, finally effectively solving the problem of the deviation of a process result of the edge of said workpiece.

WO/2021/112991	SUBSTRATE SUPPORTS WITH INTEGRATED RF FILTERS
JP2012151115	TOROIDAL LOW ELECTRIC FIELD REACTIVE GAS AND PLASMA SOURCE HAVING DIELECTRIC VACUUM TANK
WO/2023/001824	HOLDING DEVICE ARRANGEMENT FOR USE IN AN IMPLANTATION PROCESS OF A PIEZOELECTRIC SUBSTRATE

WANG GUIBIN (CN)
WEI GANG (CN)

PCT/CN2020/093701

December 24, 2020

June 01, 2020

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BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD (CN)

H01J37/32

CN110416049A	2019-11-05
US20190122864A1	2019-04-25
US20190122864A1	2019-04-25
JPS61119686A	1986-06-06
US20030201069A1	2003-10-30
US20010022293A1	2001-09-20
CN102763197A	2012-10-31
CN106415779A	2017-02-15
CN106920729A	2017-07-04

TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)

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