Title:
LOWER LAYER FILM-FORMING COMPOSITION, PATTERN FORMING METHOD, COPOLYMER, AND MONOMER FOR LOWER LAYER FILM-FORMING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/163975
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a lower layer film-forming composition having high persistence with respect to organic solvents, and being capable of forming a lower layer film having excellent etching resistance and low UV light reflectance. The present invention is related to a lower layer film-forming composition that comprises copolymers and an organic solvent, and is used for forming patterns, wherein the copolymers comprise (a) units derived from a saccharide derivative, (b) units derived from a compound having a light reflection prevention function, and (c) units derived from a compound that enables cross-coupling of the copolymer; the (a) units derived from the saccharide derivative comprises at least one type of unit selected from a unit derived from pentose derivatives and a unit derived from hexose derivatives, and the lower layer film-forming compound is for metal introduction.
Inventors:
HATTORI KIMIKO (JP)
MORITA KAZUYO (JP)
MORITA KAZUYO (JP)
Application Number:
PCT/JP2019/006950
Publication Date:
August 29, 2019
Filing Date:
February 25, 2019
Export Citation:
Assignee:
OJI HOLDINGS CORP (JP)
International Classes:
G03F7/11; C08F220/62; C08L33/14
Domestic Patent References:
| WO2011021398A1 | 2011-02-24 | |||
| WO2009104643A1 | 2009-08-27 | |||
| WO2019012716A1 | 2019-01-17 |
Foreign References:
| JP2007017950A | 2007-01-25 | |||
| JP2003183569A | 2003-07-03 | |||
| JP2011145424A | 2011-07-28 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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