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Patent Searching and Data


Title:
LUMINESCENT ELEMENT MODULE
Document Type and Number:
WIPO Patent Application WO/2008/018336
Kind Code:
A1
Abstract:
A luminescent element module (40) which comprises a base (1), a luminescent element (LED bare chip (20)) disposed thereon, and a first encapsulant (31) and a second encapsulant (32) which have been superposed in this order on the element. In order to prevent reflection at the interface (33) between the first encapsulant (31) and the second encapsulant (32) and thereby improve the efficiency of light extraction from the luminescent element, the interface (33) between a first encapsulating resin material (31o) and a second encapsulating resin material (32o) is made gradational before the first encapsulating resin material (31o) and the second encapsulating resin material (32o) are completely cured.

Inventors:
HATSUDA, Kouki (18 Satsuki-cho, Kanuma-sh, Tochigi 01, 3228501, JP)
初田 弘毅 (〒01 栃木県鹿沼市さつき町18 ソニーケミカル&インフォメーションデバイス株式会社 鹿沼事業所 第1工場内 Tochigi, 3228501, JP)
Application Number:
JP2007/065050
Publication Date:
February 14, 2008
Filing Date:
August 01, 2007
Export Citation:
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Assignee:
SONY CHEMICAL & INFORMATION DEVICE CORPORATION (Gate City Osaki East Tower 8F, 1-11-2 Osaki, Shinagawa-k, Tokyo 32, 1410032, JP)
ソニーケミカル&インフォメーションデバイス株式会社 (〒32 東京都品川区大崎一丁目11番2号 ゲートシティ大崎イーストタワー8階 Tokyo, 1410032, JP)
HATSUDA, Kouki (18 Satsuki-cho, Kanuma-sh, Tochigi 01, 3228501, JP)
International Classes:
H01L33/54; H01L33/56; H01L33/62; H01L33/00
Attorney, Agent or Firm:
TAJIME & TAJIME (Room No. 201, New-Well-Ikuta Bldg. 26-28, Mita 1-chome, Tama-ku, Kawasaki-sh, Kanagawa 34, 2140034, JP)
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