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Patent Searching and Data


Title:
METHOD FOR FORMING Ti-BASED FILM AND STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2007/105432
Kind Code:
A1
Abstract:
In a chamber (31) for storing a wafer (W), a Ti film is formed on the surface of the wafer (W) arranged in the chamber (31) by discharging a processing gas including a TiCl4 gas from a shower head (40) whose at least surface is composed of a Ni containing material. The Ti film is formed on a prescribed number of wafers (W) by setting the temperature of the shower head (40) at 300°C or higher but lower than 450°C, and a TiCl4 gas flow quantity at 1-12mL/min(sccm) or TiCl4 partial pressure at 0.1-2.5Pa. Then, ClF3 gas is introduced into the chamber (31) by setting the temperature of the shower head (40) at 200-300°C, and the inside of the chamber (31) is cleaned.

Inventors:
NARUSHIMA KENSAKU (JP)
WAKABAYASHI SATOSHI (JP)
TADA KUNIHIRO (JP)
Application Number:
PCT/JP2007/053152
Publication Date:
September 20, 2007
Filing Date:
February 21, 2007
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
NARUSHIMA KENSAKU (JP)
WAKABAYASHI SATOSHI (JP)
TADA KUNIHIRO (JP)
International Classes:
C23C16/44; C23C16/14
Foreign References:
JP2002155364A2002-05-31
JP2005194540A2005-07-21
JP2005248231A2005-09-15
JP2003313666A2003-11-06
JP2002526648A2002-08-20
JP2001247968A2001-09-14
Attorney, Agent or Firm:
TAKAYAMA, Hiroshi (Akasaka 2-chome Minato-k, Tokyo 52, JP)
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