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Patent Searching and Data


Title:
MOLDING COMPOSITION FOR SiC AND GaN ELEMENT SEALING, AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/044133
Kind Code:
A1
Abstract:
A molding composition for SiC and GaN element sealing containing (A) a maleimide resin, (B) a curing agent, (D) a curing accelerator, and (E) a filler, the (E) filler containing (e-1) a hollow structured filler.

Inventors:
WATANABE, Naoki (6 Takeda Tobadono-cho, Fushimi-ku, Kyoto-sh, Kyoto 01, 〒6128501, JP)
KURA, Isato (6 Takeda Tobadono-cho, Fushimi-ku, Kyoto-sh, Kyoto 01, 〒6128501, JP)
Application Number:
JP2018/023651
Publication Date:
March 07, 2019
Filing Date:
June 21, 2018
Export Citation:
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Assignee:
KYOCERA CORPORATION (6 Takeda Tobadono-cho, Fushimi-ku Kyoto-sh, Kyoto 01, 〒6128501, JP)
International Classes:
C08L79/00; C08K7/22; C08L61/00; C08L63/00; H01L23/12; H01L23/29; H01L23/31
Domestic Patent References:
WO2016158066A12016-10-06
WO2017170375A12017-10-05
Foreign References:
JP2017145366A2017-08-24
JP2015053341A2015-03-19
JP2013127022A2013-06-27
JP2015147850A2015-08-20
JP2014122292A2014-07-03
JP2016224338A2016-12-28
JPH10298407A1998-11-10
JP2017190396A2017-10-19
Attorney, Agent or Firm:
HIRASAWA, Kenichi et al. (OHTANI PATENT OFFICE, Toranomon ES Bldg. 7F. 25-2, Toranomon 3-chome, Minato-k, Tokyo 01, 〒1050001, JP)
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