MACHINING APPARATUS FOR INTEGRATED GRINDING AND POLISHING OF DIAMOND AND MACHINING METHOD THEREOF

WIPO Patent Application WO/2022/142158

A1

A machining apparatus for integrated grinding and polishing of diamond, comprising a rack, a base device (1) and a grinding and polishing device (2); the base device (1) comprises a slide base capable of being fed along a Y-axis with respect to the rack and a base (11) capable of being rotatably connected to the slide base around a Z-axis, wherein a clamp (12) capable of clamping diamond (3) is mounted on the base (11); the grinding and polishing device (2) comprises a main shaft arranged along the Z-axis, wherein an inner ring grinding wheel (21) and an outer ring polishing wheel (22) are sleeved on the main shaft, and when the main shaft rotates, the inner ring grinding wheel (21) and the outer ring polishing wheel (22) can be driven to rotate together; and the diamond (3) is ground and polished by means of rotation of the inner ring grinding wheel (21) and the outer ring polishing wheel (22), feeding of the slide base and rotation of the base (11). The machining apparatus can integrate the grinding and polishing of diamond into one process of machining, and the diamond has less surface scratch damage and uniform surface quality. Also provided is a machining method.

LU JING (CN)
WEN HAILANG (CN)
LUO QIUFA (CN)
LI CHEN (CN)
AI TENGFENG (CN)

PCT/CN2021/099947

July 07, 2022

June 15, 2021

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UNIV HUAQIAO (CN)

B24B47/20; B24B37/07

CN112676999A	2021-04-20
CN102554760A	2012-07-11
CN205651216U	2016-10-19
DE102009025116A1	2010-12-16
CN104972410A	2015-10-14
CN2127336Y	1993-02-24

SHOUCHUANG JUNHE PATENT AGENT CO., LTD.XIAMEN (CN)

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