Description

MACHINING APPARATUS AND SEMICONDUCTOR STRIP MACHINING SYSTEM USING THE SAME

Technical Field

[1] The present invention relates to a semiconductor manufacturing apparatus, and more particularly, to a machining apparatus for cutting a semiconductor strip into individual semiconductor packages in a semiconductor cutting process and a semiconductor strip machining system using the same. Background Art

[2] Generally, a semiconductor manufacturing process mainly includes a fabrication

(FAB) process and an assembly process. In the FAB process, an integrated circuit is designed on a silicon wafer, to form a semiconductor chip. In the assembly process, a lead frame is attached to the semiconductor chip. In the assembly process, a wire bonding process or a soldering process for forming solder balls, to electrically connect the semiconductor chip and lead frame, and a molding process using a resin material such as an epoxy resin are then sequentially carried out, to form a semiconductor strip.

[3] The semiconductor strip is fed to a cutting device by a certain picker in a state of being seated on a chuck table, and is then cut into individual packages by a rotating blade. In order to execute the above-mentioned processes, a semiconductor manufacturing apparatus is provided.

[4] However, the above-mentioned prior art has the following problems.

[5] In conventional semiconductor strip machining systems, the cutting device thereof comprises only a blade. For this reason, it is impossible to cut a semiconductor strip along a curved line other than a straight line. As a result, the conventional semiconductor strip machining systems cannot cope with various tasks.

[6] Furthermore, when the semiconductor strip is cut by the cutting device under the condition in which the seating position of the semiconductor strip on the chuck table is misaligned from a desired position, a poor product may be generated because there is no means capable of automatically correcting the misalignment.

Disclosure of Invention

Technical Problem

[7] The present invention has been made in view of the above-mentioned problems, and it is an object of the present invention is to provide a machining apparatus having a cutting device capable of achieving a cutting process along a curved line and a semiconductor strip machining system using the same.

[8] Another object of the present invention is to provide a machining apparatus capable

of sensing a position of a semiconductor strip seated on a chuck table, and correcting the position of a cutting device in accordance with the sensed position, and a semiconductor strip machining system using the same. Technical Solution

[9] In one aspect of the present invention, a machining apparatus comprises: a chuck table unit including a pair of chuck tables simultaneously movable in an X-axis direction while being individually movable in an Y-axis direction; and a cutting unit for machining articles respectively seated on the chuck tables.

[10] In another aspect of the present invention, a machining apparatus comprises: a chuck table unit including four chuck tables simultaneously movable in an X-axis direction while being individually movable in an Y-axis direction; and two cutting units for machining articles seated on first and third ones of the chuck tables or articles seated on second and fourth ones of the chuck tables.

[11] The machining apparatus may further comprise a sensing unit for acquiring information as to a position of each article, and sending the information to the associated cutting unit, the sensing unit including a vision for acquiring the information as to the position of each article, and a vosion rail for allowing the vision along the vision rail.

[12] The chuck table unit may include the chuck tables for supporting the semiconductor strips, a first feeding member for allowing the chuck tables to be fed in the X-axis direction, and a second feeding member for allowing the chuck tables to be fed in the Y-axis direction.

[13] Each chuck table may be rotatable 360°

[14] The chuck table unit may include the chuck tables for supporting the semiconductor strips, a vertical driver for enabling the chuck tables to move vertically, and a horizontal driver for enabling the chuck tables to move horizontally.

[15] In another aspect of the present invention, a semiconductor strip machining system comprises: a loading section for receiving a plurality of semiconductor strips; a cutting section comprising the above-described machining apparatus; an unloading section for receiving semiconductor packages produced after the semiconductor strips are completely machined; and a feeding section for picking up the semiconductor strips or the semiconductor packages, and feeding the picked-up semiconductor strips or semiconductor packages to the loading section, the cutting section, or the unloading section.

[16] In another aspect of the present invention, a semiconductor strip machining system comprises: a first loading section for receiving a plurality of semiconductor strips; a first cutting section comprising the above-described machining apparatus; a first unloading section for receiving the semiconductor strips, which have been completely machined in the first cutting section; a feeding section for picking up the semi-

conductor strips, and feeding the picked-up semiconductor strips to the first loading section, the first cutting section, or the first unloading section; a second loading section for receiving the semiconductor strips unloaded from the first unloading section; a second cutting section including a turntable, on which the semiconductor strips are laid, and a second cutting unit for machining the semiconductor strips into semiconductor packages; an inspection section for inspecting whether or not the semiconductor packages completely machined in the second cutting section are defective; a second unloading section for receiving the semiconductor packages completely inspected by the inspection section; and a conveyor for feeding the semiconductor strips between the first unloading section and the second unloading section.

[17] The cutting unit of the first cutting section may comprise a laser cutting device. The second cutting unit may comprise a blade.

[18] The first cutting section may further comprise a sensing unit for acquiring information as to a position of the semiconductor strip seated on each chuck table. The first cutting section may receive the information from the sensing unit, and correct a machining position of the cutting unit of the first cutting section for the semiconductor strip.

[19] The second cutting section may include the turntable, on which the semiconductor strips are laid, the turntable being movable in an Y-axis direction while being rotatable, and a blade movable in a Y-axis direction around the turntable.

[20] In still another aspect of the present invention, a semiconductor strip machining system comprises: a loading section for receiving a plurality of semiconductor strips; the above-described machining apparatus; a washing/drying section for washing and drying semiconductor packages produced after the semiconductor strips are completely machined; an inspection section for inspecting whether or not the semiconductor packages completely washed and dried are defective; an unloading section for receiving the completely-inspected semiconductor packages; and a feeding section for picking up the semiconductor strips or the semiconductor packages, and feeding the picked-up semiconductor strips or semiconductor packages to the loading section, the machining apparatus, the washing/drying section, the inspection section, or the unloading section.

[21] The loading section may include a loading magazine for stacking the semiconductor strips, a transfer device for transferring the loading magazine, a first turn rail for rotating the semiconductor strips fed by the transfer device, and a pusher for feeding the semiconductor strips stacked in the loading magazine to the first turn rail. The unloading section may include a second turn rail for receiving and rotating the semiconductor strips completely cut and fed by the feeding section, an unloading magazine for staking the completely-cut semiconductor strips, a transfer device for transferring

the unloading magazine, and a gripper for transferring the completely-cut semiconductor strips stacked on the second turn rail to the unloading magazine. Brief Description of the Drawings

[22] The accompanying drawings, which are included to provide a further understanding of the invention, illustrate embodiments of the invention and together with the description serve to explain the principle of the invention.

[23] In the drawings:

[24] FIG. 1 is a configuration view illustrating a first embodiment of a semiconductor strip machining system according to the present invention;

[25] FIGs. 2 to 8 are configuration views illustrating sequential operations of the configuration of FIG. 1 ;

[26] FIG. 9 is a plan view illustrating a state of one semiconductor strip, to be machined in accordance with the present invention, before machining;

[27] FIG. 10 is a plan view illustrating a first embodiment of a cut structure of the semiconductor strip of FIG. 9;

[28] FIG. 11 is a plan view illustrating a second embodiment of the cut structure of a cut state of the semiconductor strip of FIG. 9;

[29] FIG. 12 is a plan view illustrating a third embodiment of the cut structure of a cut state of the semiconductor strip of FIG. 9;

[30] FIG. 13 is a configuration view illustrating a second embodiment of the semiconductor strip machining system according to the present invention;

[31] FIG. 14 is a configuration view illustrating a third embodiment of the semiconductor strip machining system according to the present invention;

[32] FIG. 15 is a configuration view illustrating a fourth embodiment of the semiconductor strip machining system according to the present invention;

[33] FIG. 16 is a configuration view illustrating a fifth embodiment of the semiconductor strip machining system according to the present invention; and

[34] FIG. 17 is a front view illustrating the configuration of the semiconductor strip machining system according to the present invention. Best Mode for Carrying Out the Invention

[35] Preferred embodiments of a machining apparatus and a semiconductor strip machining system according to the present invention will be described in detail with reference to the accompanying drawings.

[36] Referring to FIG. 1, a first embodiment of the semiconductor strip machining system is illustrated. The semiconductor strip machining system illustrated in FIG. 1 includes a loading section 100 for receiving an article to be machined, and loading the article in a loading stage, a cutting section 300 for machining the loaded article, an unloading

section 400 for receiving the completely-machined article, and unloading the completely-machined article to the outside of the stage of the machining system, and a feeding section 200 for feeding the loaded article to the loading section 100, cutting section 300, and unloading section 400.

[37] The loading section 100 includes a plurality of loading magazines 102. In each loading magazine 102, a plurality of semiconductor strips SS to be machined may be stacked in the form of cassette magazines. Of course, only one semiconductor strip SS may be stacked in each loading magazine 102.

[38] The loading section 100 also includes a first transfer device 104 for feeding the loading magazines 102 one by one. The first transfer device 104 may use various driving systems. Preferably, the first transfer device 104 uses a belt driving system.

[39] A loader 105 is arranged at one end of the first transfer device 104. The loader 105 includes a pusher 106. The pusher 106 functions to move, one by one, the semiconductor strips SS stacked in the loading magazine 102 moved to the pusher 106 by the first transfer device 104 by pushing one side of each semiconductor strip SS, and thus to cause the semiconductor strips SS to be seated, one by one, on a first turn rail 112, which will be described later.

[40] The loader 105 also includes a first gripper 110. The first gripper 110 is arranged at one side of the loading magazine 102 such that it faces the pusher 106. Accordingly, when the pusher 106 pushes one side of one semiconductor strip SS toward the first turn rail 112, the first gripper 110 picks up and pulls the other side of the semiconductor strip SS, to enable the semiconductor strip SS to be easily fed.

[41] The loader 105 also includes the first turn rail 112. The first turn rail 112 is arranged in a movement path of the pusher 106 and first gripper 110. The first turn rail 112 comprises a pair of rails arranged to rotate 360°. The first turn rail 112 allows one semiconductor strip SS to be laid thereon, and functions to rotate the laid semiconductor strip SS, and thus to change the movement direction of the laid semiconductor strip SS.

[42] The feeding section 200 is arranged to be orthogonal to the loading section 100. The feeding section 200 functions to feed semiconductor strips SS from the loading section 100 to the unloading section 400. The feeding section 200 includes a feeding rail 202. A first picker 204 and a second picker 206 are arranged over the feeding rail 202 such that they are movable along the feeding rail 202.

[43] Of course, the first and second pickers 204 and 206 may be rotatable, in order to change the movement direction of the semiconductor strip SS in a fixed state of the first turn rail 112.

[44] Preferably, the first picker 204 is arranged over the feeding rail 202 adjacent to the loading section 100. In this case, the first picker 204 can easily pick up one semi-

conductor strip SS, and can easily feed the picked-up semiconductor strip SS to a chuck table 304, which will be described later.

[45] Preferably, the second picker 206 is arranged over the feeding rail 202 adjacent to the unloading section 400. In this case, the second picker 206 can easily pick up one semiconductor strip SS, and can easily feed the picked-up semiconductor strip SS to the unloading section 400.

[46] The cutting section 300, which machines one or more semiconductor strips SS, is arranged beneath a central portion of the feeding rail 202.

[47] The cutting section 300 includes a chuck table unit 302 installed to be horizontally movable in X and Y-axis directions. One or more semiconductor strips SS, which are to be machined, are seated on the upper surface of the chuck table unit 302. The cutting section 300 also includes a cutting unit 320 for machining one semiconductor strip SS at a point on the semiconductor strip SS or machining one semiconductor strip SS along a straight line or a curved line on the semiconductor strip SS. The cutting unit 320 can correct X-axis, Y-axis, and θ positions thereof. The cutting section 300 further includes a sensing unit 330 for acquiring information as to the position of the semiconductor strip SS to be machined, and sending the detected position information to the cutting unit 320, in order to enable the machining position of the cutting unit 320 to be corrected. In accordance with the above-described configuration, the cutting section forms a semiconductor package machining device.

[48] Of course, the semiconductor package machining device may be used as a machining device for machining an article other than the semiconductor strip SS. For example, the machining device can be used to form a certain mark on an article.

[49] As show in FIG. 1, the chuck table unit 302 includes chuck tables 304 each adapted to support one semiconductor strip SS beneath the semiconductor strip SS, and a chuck table feeder 310 for feeding the chuck tables 304.

[50] Each chuck table 304 functions to hold and support one semiconductor strip SS beneath the semiconductor strip SS during a machining operation carried out by the cutting unit 320. The machining operation of the cutting unit 320 will be described later. It will be appreciated by those skilled in the art that the chuck table 304 may have any structure.

[51] The chuck table feeder 310 includes a first feeding member 312 for feeding the chuck tables 304 in the X-axis direction, and a second feeding member 314 for feeding the chuck tables 304 in the Y-axis direction.

[52] The second feeding member 314 is arranged to be orthogonal to the feeding rail 202.

The second feeding member 314 functions to feed the chuck tables 304 in the Y-axis direction. The second feeding member 314 may have any configuration, as long as it can move the chuck tables 304. The second feeding member 314 may comprise several

feeding members arranged in parallel. In this embodiment, the second feeding member 314 comprises 4 feeding members, namely, a 2- 1st feeding member 314a, a 2-2nd feeding member 314b, a 2- 3rd feeding member 314c, and a 2-4th feeding member 314d. In this case, the second feeding member 314 may be configured to include a screw and a shaft arranged in the interior of the second feeding member 314 so that all the feeding members constituting the second feeding member 314 can be simultaneously movable.

[53] The first feeding member 312 is arranged to be orthogonal to the second feeding member 314. The first feeding member 312 functions to feed the second feeding member 314 in the X-axis direction. The feeding members constituting the second feeding member 314 may be simultaneously moved by the first feeding member 312.

[54] The cutting unit 320 is arranged above the second feeding member 314 at one side of the second feeding member 314. The cutting unit 320 functions to machine the semiconductor strip SS laid on each chuck table 304.

[55] For the cutting unit 320, various cutting devices may be used. In the embodiment illustrated in FIG. 1, the cutting unit 320 may comprise a laser cutting device. Also, the cutting unit 320 may comprise a blade, as in an embodiment illustrated in FIG. 15.

[56] The laser cutting device includes a head (not shown) mounted to a tip of the laser cutting device. The head is configured to move under the condition in which the X- axis, Y-axis, and θ positions of the head are controlled by a controller included in the laser cutting device. The laser cutting device functions to machine the semiconductor strip SS shown in FIG. 9 along curved and straight lines, as shown in FIGs. 10 to 12. Of course, it is possible to machine the semiconductor strip SS such that the semiconductor strip SS is cut into individual semiconductor packages SP.

[57] Several laser cutting devices may be used. In this connection, in the embodiment illustrated in FIG. 1, the cutting unit 320 comprises two cutting units, namely, a first cutting unit 320a and a second cutting unit 320b.

[58] The first and second cutting units 320a and 320b are arranged over the second feeding member 314. As shown in FIG. 1, the first and second cutting units 320a and 320b may be arranged over the 2-2nd feeding member 314b and 2-4th feeding member 314d, respectively. Of course, the first and second cutting units 320a and 320b may be arranged over the 2- 1st feeding member 314a and 2-3rd feeding member 314c, respectively.

[59] The sensing unit 330 is arranged over the second feeding member 314 at one side of the second feeding member 314.

[60] The sensing unit 330 includes a vision 332 for sensing the position of the semiconductor strip SS seated on each chuck table 304 coupled to the second feeding member 314. The vision 332 senses the position of the semiconductor strip SS, and

sends information as to the sensed position of the semiconductor strip SS to the controller (not shown) of the laser cutting device, in order to enable the head of the laser cutting device to be adjusted in beam emission direction.

[61] A scrap box 350 is arranged in the cutting section 300 beneath a region where the cutting unit 320 is positioned. The scrap box 350 functions as a discharge passage for removing foreign matter produced during the machining operation by the weight of foreign matter.

[62] A vision rail 334 is arranged above the second feeding member 314 such that the vision rail 334 is orthogonal to the second feeding member 314 while being parallel to the first feeding member 312. The vision rail 334 allows the vision 332 to move therealong.

[63] The unloading section 400 is arranged at the side of the feeding section 200 opposite to the loading section 100. The unloading section 400 includes a plurality of unloading magazines 402. In each unloading magazine 402, a plurality of completely-machined semiconductor strips SS may be stacked. Of course, only one semiconductor strip SS may be stacked in each unloading magazine 402.

[64] The unloading section 400 also includes a second transfer device 404 for feeding the unloading magazines 402 one by one. The second transfer device 404 may use various driving systems. Preferably, the second transfer device 404 uses a belt driving system.

[65] An unloader 410 is arranged at one end of the second transfer device 404. The unloader 410 includes a second turn rail 412 arranged beneath the movement path of the second picker 206. The second turn rail 412 comprises a pair of rails arranged to rotate 360°. The second turn rail 412 allows one semiconductor strip SS to be laid thereon, and functions to rotate the laid semiconductor strip SS, and thus to change the movement direction of the laid semiconductor strip SS.

[66] The unloader 410 also includes a second gripper 414. The second gripper 414 picks up one side of the semiconductor strip SS laid on the second turn rail 412, and feeds the picked-up semiconductor strip SS to the side of the unloading magazines 402 of the unloader 410.

[67] The unloader 410 should be configured such that, when the semiconductor strip SS is divided into individual semiconductor packages SP as it is completely cut, the unloader 410 picks up the individual semiconductor packages SP, and feeds the picked-up semiconductor packages SP to the unloading section 400.

[68] The operation of the first embodiment of the semiconductor strip machining system according the present invention having the above-described configuration will be described in detail.

[69] When one semiconductor strip SS is seated on one loading magazine 102 of the loading section 100, as shown in FIG. 2, the first transfer device 104 operates to move

the loading magazine 102 to the pusher 106.

[70] The pusher 106 operates when the loading magazine 102 is aligned with the movement direction of the pusher 106. In accordance with the operation of the pusher 106, one semiconductor strip SS is moved to the first turn rail 112.

[71] When the semiconductor strip SS moves to the first turn rail 112, the first gripper 110 picks up the side of the semiconductor strip SS opposite to the pusher 106, and pulls the semiconductor strip SS toward the first turn rail 112. That is, the semiconductor strip SS is seated on the first turn rail 112 in accordance with the co-operation of the pusher 106 and first gripper 110.

[72] When the semiconductor strip SS is seated on the first turn rail 112, the first turn rail

112 rotates to align the semiconductor strip SS with the arrangement of the chuck tables 304, as shown in FIG. 3, and thus to enable the semiconductor strip SS to be easily seated on one of the chuck tables 304.

[73] When the first turn rail 112 rotates, the first picker 204 moves along the feeding rail

202, and picks up the semiconductor strip SS seated on the first turn rail 112. The first picker 204 then seats the picked-up semiconductor strip SS on the chuck table 304 arranged over one of the 2-2nd feeding member 314b and 2-4th feeding member 314d. Subsequently, the first picker 204 seats another semiconductor strip SS, fed in the same manner as described above, on the chuck table 304 arranged over the other one of the 2-2nd feeding member 314b and 2-4th feeding member 314d. Of course, the first picker 204 may seat the picked-up semiconductor strips SS on the chuck tables 304 arranged over the 2- 1st feeding member 314a and 2-3rd feeding member 314c. When the semiconductor strips SS are seated on the chuck tables 304 coupled to the 2-2nd feeding member 314b and 2-4th feeding member 314d, respectively, the chuck tables 304 move in the Y-axis direction along the associate feeding members of the second feeding member 314.

[74] As the chuck tables 304 move in the Y-axis direction along the second feeding member 314, they pass through the sensing unit 330. At this time, the vision 332 of the sensing unit 330 acquires information as to the position of the semiconductor strip SS seated on each of the moved chuck tables 304, and sends the acquired information to the controller of the cutting unit 320.

[75] The position information is acquired as the vision 332 of the sensing unit 330 detects the position of a specific mark provided at a certain position on the semiconductor strip SS. Based on the position information, it is possible to determine the position of the semiconductor strip SS.

[76] After receiving the information, the controller corrects the position of the head of the cutting unit 320, based on the information. In this case, the sensing unit 330 senses the positions of the semiconductor strips SS seated on the chuck tables 304 coupled to the

2-2nd and 2-4th feeding members 314b and 314d because the first and second cutting units 320a and 320b constituting the cutting unit 320 are arranged over the 2-2nd and 2-4th feeding members 314b and 314d, respectively, as shown in FIG. 4.

[77] Meanwhile, during the machining process for the semiconductor strips SS on the chuck tables 304 of the 2-2nd and 2-4th feeding members 314b and 314d, semiconductor strips SS are seated on the chuck tables 304 of the 2- 1st and 2-3rd feeding members 314a and 314c, as shown in FIG. 5.

[78] Thereafter, the chuck tables 304 of the 2-lst and 2-3rd feeding members 314a and

314c move to a region defined beneath the vision rail 334 of the sensing unit 330, as shown in FIG. 6. Accordingly, the vision 332 detects the positions of the semiconductor strips SS on the chuck tables 304 of the 2-lst and 2-3rd feeding members 314a and 314c, to enable the position correction of the cutting unit 320.

[79] When the machining process for the semiconductor strips SS on the chuck tables 304 of the 2-2nd and 2-4th feeding members 314a and 314c is completed, the feeding members constituting the second feeding member 314 are simultaneously moved in the X-axis direction by the first feeding member 312. As a result, the chuck tables 304 of the 2-lst and 2-3rd feeding members 314a and 314c are positioned beneath the first and second cutting units 320a and 320b constituting the cutting unit 320, respectively.

[80] Thus, the cutting of the semiconductor strips SS on all chuck tables 304 can be completed. After the completion of the cutting of the semiconductor strips SS, the chuck tables 304 are returned to original positions thereof by the chuck table feeder 310.

[81] When all chuck tables 304 are positioned to the original positions thereof, the second picker 206 moves to a region defined over the chuck tables 304. The second picker 206 then picks up the semiconductor strips SS, one by one, and seats the picked-up semiconductor strip SS to the second turn rail 412.

[82] At this time, the second turn rail 412 is in a rotated state such that it is parallel to the chuck tables 304, in order to easily receive the semiconductor strip SS picked up by the second picker 206, as shown in FIG. 8.

[83] When one semiconductor strip SS is seated on the second turn rail 412, the second gripper 414 picks up the semiconductor strip SS, and moves the picked-up semiconductor strip SS to the side of the unloading magazines 402 of the unloading section 400. When the semiconductor strip SS is seated on one unloading magazine 402, the second transfer device 404 operates to transfer the semiconductor strip SS to the next stage. Thus, the machining process is completed.

[84] Of course, when the form of the semiconductor strip SS completely machined in the cutting section 300 is a semiconductor package form, the unloading system may be configured such that the unloading of the semiconductor strip SS is carried out in the

unit of individual semiconductor packages SP.

[85] Hereinafter, a second embodiment of the semiconductor strip machining system will be described in detail. The semiconductor strip machining system illustrated in FIG. 13 includes a loading section 1000 for receiving a plurality of semiconductor strips SS, and a first cutting section 3000. The first cutting section 3000 includes a chuck table unit 3002 including chuck tables 3004, on which the semiconductor strips SS will be seated one by one. The chuck tables 3004 are movable in X and Y-axis directions. The first cutting section 3000 also includes a first cutting device for machining curved and straight portions of the semiconductor strip SS seated on each chuck table 3004. The semiconductor strip machining system also includes a first unloading section 4000 for receiving the semiconductor strip SS completely machined in the first cutting section 3000, and a first feeding section 2000 for picking up the semiconductor strips SS one by one and feeding the picked-up semiconductor strips SS to the first cutting section 3000 or first unloading section 4000 one by one. The semiconductor strip machining system further includes a second loading section 3204 for receiving the semiconductor strips SS unloaded from the first unloading section 4000, a second cutting section 3200 including a turntable 3226, on which the semiconductor strips SS will be seated one by one, the turntables 3336 being movable in the X-axis direction, and a second cutting device installed to be movable in the X-axis direction, to machine, one by one, the semiconductor strips SS into individual semiconductor packages SP, an inspector 5020 for inspecting whether or not the semiconductor packages SP completely machined in the second cutting section 3200 are defective, a second unloading section 5000 for receiving the semiconductor packages SP completely inspected in the inspector 5020, and a conveyor 3202 for feeding the semiconductor strips SS between the first unloading section 4000 and the second loading section 3204.

[86] The first loading section 1000 includes a plurality of first loading magazines 1002. In each first loading magazine 1002, a plurality of semiconductor strips SS to be cut may be stacked. Of course, only one semiconductor strip SS may be stacked in each first loading magazine 1002.

[87] The first loading section 1000 also includes a first transfer device 1004 for feeding the first loading magazines 1002 one by one. The first transfer device 1004 may use various driving systems. Preferably, the first transfer device 1004 uses a belt driving system.

[88] A first loader 1005 is arranged at one end of the first transfer device 1004. The first loader 1005 includes a first pusher 1006. The first pusher 1006 functions to move, one by one, the semiconductor strips SS stacked in the first loading magazine 1002 moved to the first pusher 1006 by the first transfer device 1004 by pushing one side of each semiconductor strip SS, and thus to cause the semiconductor strips SS to be seated, one

by one, on a first turn rail 1008.

[89] The first loader 1005 also includes a first gripper 1010. The first gripper 1010 is arranged to face the first pusher 1006. Accordingly, when the first pusher 1006 pushes one side of one semiconductor strip SS toward the first turn rail 1008, the first gripper 1010 picks up and pulls the other side of the semiconductor strip SS, to enable the semiconductor strip SS to be easily fed.

[90] The first loader 1005 also includes the first turn rail 1008. The first turn rail 1008 is arranged in a movement path of the first pusher 1006. The first turn rail 1008 comprises a pair of rails arranged to rotate 360 . The first turn rail 1008 allows one semiconductor strip SS to be laid thereon, and functions to rotate the laid semiconductor strip SS, and thus to allow the laid semiconductor strip SS to move in other directions.

[91] The first feeding section 2000 is arranged to be orthogonal to the first loading section

1000. The first feeding section 2000 functions to feed semiconductor strips SS from the first loading section 1000 to the first cutting section 3000 or first unloading section 4000 one by one.

[92] The first feeding section 2000 includes a first feeding rail 2002. A first picker 2004 is arranged at one side of the first feeding rail 2002 such that it is movable along the first feeding rail 2002.

[93] In detail, the first picker 2004 may be arranged over the first feeding rail 2002 adjacent to the first loading section 1000. The first picker 2004 picks up the semiconductor strips SS one by one, and feeds the picked-up semiconductor strips SS to the chuck tables 3004, which will be described later.

[94] A second picker 2006 is also arranged over the first feeding rail 2002. The second picker 2006 picks up the primarily-cut semiconductor strips SS one by one, and feeds the picked-up semiconductor strips SS to the first unloading section 4000.

[95] The first cutting section 3000 is arranged beneath a central portion of the first feeding rail 2002. The first cutting section 3000 includes a cutting device. The first cutting section 3000 has the same configuration as the cutting section 300 in the first embodiment. Accordingly, the constituent elements of the first cutting section 3000 are designated by reference numerals of a 3000 mark, in place of reference numerals of a 300 mark in FIG. 1, and no detailed description thereof will be given.

[96] However, the first cutting section 3000 functions to machine the semiconductor strips

SS along straight and curved lines. That is, the first cutting section 3000 functions to cut portions of each semiconductor strip SS difficult to be machined, along straight and curved lines, using a curved blade, without completely cutting the semiconductor strip SS, as shown in FIG. 10.

[97] The first unloading section 4000 is arranged at the side of the first feeding rail 2002

opposite to the first loading section 1000. The first unloading section 4000 includes a plurality of first unloading magazines 4002. In each first unloading magazine 4002, a plurality of primarily-cut semiconductor strips SS may be stacked. Of course, only one semiconductor strip SS may be stacked in each first unloading magazine 4002.

[98] The first unloading section 4000 also includes a second transfer device 4004 for feeding the first unloading magazines 4002 one by one. The second transfer device 4004 may use various driving systems. Preferably, the second transfer device 4004 uses a belt driving system.

[99] A first unloader 4010 is arranged at one end of the first unloading section 4000. The first unloader 4010 includes a second turn rail 4012 arranged beneath the movement path of the second picker 2006. The second turn rail 4012 comprises a pair of rails arranged to rotate 360 . The second turn rail 4012 allows one semiconductor strip SS to be laid thereon, and functions to rotate the laid semiconductor strip SS, and thus to change the movement direction of the laid semiconductor strip SS.

[100] The first unloader 4010 also includes a second gripper 4014. The second gripper

4014 picks up the semiconductor strip SS laid on the second turn rail 4012, and seats the picked-up semiconductor strip SS on one of the unloading magazines 4002.

[101] The conveyor 3202 is arranged between the second unloading section 4000 and the second loading section 3204. The conveyor 3202 functions to feed the primarily-cut semiconductor strips SS from the first cutting section 3000 to the second cutting section 3200.

[102] The second loading section 3204 is arranged at one end of the conveyor 3202. The second loading section 3204 includes a plurality of second loading magazines 3206. In each second loading magazine 3206, a plurality of semiconductor strips SS to be cut may be stacked. Of course, only one semiconductor strip SS may be stacked in each second loading magazine 3206.

[103] The second loading section 3204 also includes a third transfer device 3208 for feeding the second loading magazines 3206 one by one. The third transfer device 3208 may use various driving systems. Preferably, the third transfer device 3208 uses a belt driving system.

[104] The second loading section 3204 includes a second loader 3209. The second loader 3209 includes a second pusher 3210. The second pusher 3210 functions to move, one by one, the semiconductor strips SS stacked in the second loading magazine 3206 moved to the second pusher 3210 by the third transfer device 3208 by pushing one side of each semiconductor strip SS, and thus to cause the semiconductor strips SS to be seated, one by one, on an inlet rail 3218.

[105] The inlet rail 3218 comprises a pair of rails. The inlet rail 3218 functions to temporarily store one semiconductor strip SS in the movement path of a third picker

3216, in order to enable the third picker 3216 to easily pick up the semiconductor strip SS.

[106] The second loader 3209 also includes a third gripper 3220. The third gripper 3220 is arranged to face the second pusher 3210. Accordingly, when the second pusher 3210 pushes one side of one semiconductor strip SS toward the inlet rail 3218, the third gripper 3220 picks up and pulls the other side of the semiconductor strip SS.

[107] The second feeding section 3212 is arranged in parallel to the second loading section 3204. The second feeding section 3212 includes a second feeding rail 3214. The third picker 3216 is arranged over the second feeding rail 3214 such that it is movable along the second feeding rail 3214. The third picker 3216 picks up the semiconductor strips SS one by one, and feeds the picked-up semiconductor strip SS to the turntable 3226, which will be described later.

[108] The second cutting section 3200 is arranged at a central portion of the second feeding section 3212. The second feeding section 3200 is arranged beneath the second feeding section 3212. The second cutting section 3200 includes a blade unit 3224, in addition to the turntable 3226.

[109] The blade unit 3224 is provided with a blade at one side thereof, to cut each semiconductor strip SS. The blade unit 3224 may comprise a pair of blade units.

[110] The blade unit 3224 machines each semiconductor strip SS into semiconductor packages SP by cutting the semiconductor strip SS into pieces of a desired size.

[I l l] The turntable 3226 is arranged at one side of the second cutting section 3200. The turntable 3226 is rotatable 360 by a motor. A chuck table 3230 may be arranged on the turntable 3226.

[112] The chuck table 3230 functions to hold and support one semiconductor strip SS beneath the semiconductor strip SS during a cutting operation of the blade unit 3224 for the semiconductor strip SS. It will be appreciated by those skilled in the art that the chuck table 3230 may have any structure.

[113] A scrap box (not shown) may be arranged in a bottom portion of the second cutting section 3200, in order to remove foreign matter produced when each semiconductor strip SS is machined into semiconductor packages SP. In place of the scrap box, an air head (not shown) may be arranged at one side of the second cutting section 3200, to cause the foreign matter to flow in one direction.

[114] A fourth picker 3232 is arranged at one side of the second feeding section 3212 such that it is movable along the second feeding rail 3214. The fourth picker 3232 functions to feed the semiconductor strip completely cut on the turntable 3226 to the second unloading section 5000.

[115] A washer/dryer 3234 is arranged in the movement path of the fourth picker 3232. The washer/dryer 3234 functions to wash and dry the semiconductor packages

emerging from the second cutting section 3200 after the completion of the machining operation.

[116] The second unloading section 5000 includes a drying block 5002 for completely drying the semiconductor packages SP fed by the fourth picker 3232. The drying block 5002 functions to completely remove moisture remaining on the semiconductor packages SP after a washing operation carried out in the washer/dryer 3234, before the execution of an inspection operation in the inspector 5020, which will be described later.

[117] The second unloading section 5000 includes a third feeding rail 5004. A fifth picker 5006 is arranged over the third feeding rail 5004 such that it is movable along the third feeding rail 5004. The fifth picker 5006 functions to feed the semiconductor packages SP completely dried in the drying block 5002 to a seat block 5008. The seat block 5008 temporarily stores the semiconductor packages SP before the inspection.

[118] The seat block 5008 is arranged at one side of the movement path of the fifth picker 5006 beneath the movement path of the fifth picker 5006. The seat block 5008 is arranged on a seat block feeding rail 5010 extending orthogonally to the third feeding rail 5004, such that the seat block 5008 is movable to the inspector 5020 along the seat block feeding rail 5010.

[119] A sixth picker 5012 is arranged at one side of the third feeding rail 5004. The sixth picker 5012 functions to feed the semiconductor packages SP completely inspected by the inspector 5020 to a receiver 5022, which will be described later.

[120] The second unloading section 5000 also includes a semiconductor package feeding section 5014 arranged in parallel to the third feeding rail 5004 while being orthogonal to the seat block feeding rail 5010. The semiconductor package feeding section 5014 includes a semiconductor package feeding rail 5016, and a semiconductor package picker 5018 movable along the semiconductor package feeding rail 5016.

[121] The semiconductor package picker 5018 picks up the semiconductor packages laid on the seat block 5009 moving along the seat block feeding rail 5010, and moves the picked-up semiconductor packages to a region defined over the inspector 5020.

[122] Several semiconductor package feeding sections 5014 may be provided in accordance with a user's desire. In this embodiment, two semiconductor package feeding sections 5014 are provided. The inspector 5020 is arranged at one side of the movement path of the semiconductor package picker 5018 beneath the movement path of the semiconductor package picker 5018. The inspector 5020 functions to inspect whether or not the semiconductor packages picked up and fed by the semiconductor package picker 5018 are defective.

[123] The receiver 5022, which is also included in the second unloading section 5000, includes a receiving tray 5024 for receiving the semiconductor packages fed from the

inspector 5020, and a receiving tray feeding rail 5026, along which the receiving tray 5024 moves.

[124] The receiving tray feeding rail 5026 extends orthogonally to the third feeding rail 5004 and semiconductor package feeding rail 5016. Several receivers 5022 may be provided. Preferably, two or more receivers 5022 are provided.

[125] One of the two or more receivers 5022 is used as a space for receiving the semiconductor packages SP determined as having a poor quality by the inspector 5020, whereas the remaining receiver or receivers 5022 are used as a space for receiving the semiconductor packages SP determined as having a normal quality by the inspector 5020.

[126] Hereinafter, the operation of the second embodiment of the semiconductor strip machining system according to the present invention will be described.

[127] The operations of the first loading section 1000, first feeding section 2000, and first unloading section 4000 in the semiconductor strip machining system of the second embodiment are identical to those of the first embodiment. Also, the operation of the first cutting section 3000 is similar to that of the cutting section 300 of the first embodiment.

[128] However, the first cutting section 3000 cuts the semiconductor strip in a manner shown in FIG. 10, different from the cutting section 300 of the first embodiment. The semiconductor strip SS cut by the first cutting section 3000 is fed to the first unloading section 4000, and is then fed from the first unloading section 4000 to the second loading section 3204 via the conveyor 3202.

[129] In detail, the semiconductor strip fed along the conveyor 3202 reaches the third transfer device 3208, and is then stacked in one of the second loading magazines 3206. When the semiconductor strip is seated on the second loading magazine 3206, the third transfer device 3208 operates to move the second loading magazine 3206 to the second pusher 3210.

[130] When the second loading magazine 3206 reaches the second pusher 3210, the second pusher 3210 pushes the semiconductor strip SS of the second loading magazine 3206 toward the third picker 3216. Subsequently, the third gripper 3220 picks up one side of the semiconductor strip SS, and feeds the picked-up semiconductor strip SS to the inlet rail 3218.

[131] When the semiconductor strip SS reaches the inlet rail 3218, the third picker 3216 picks up the semiconductor strip SS laid on the inlet rail 3218, and moves to the turntable 3226 along the second feeding rail 3214 of the second feeding section 3212. The third picker 3216 then seats the semiconductor strip SS on the chuck table 3230 of the turntable 3226.

[132] Subsequently, each blade unit 3224 operates. Each blade unit 3224 is movable in a

direction parallel to the second feeding rail 3214. In accordance with the operation of each blade unit 3224, the blade of the blade unit 3224 cuts the semiconductor strip SS while moving in a direction parallel to the second feeding rail 3214.

[133] Since the turntable 3226 is rotatable, the overall portion of the semiconductor strip SS seated on the chuck table 3230 of the turntable 3226 is cut into semiconductor packages SP, as shown in FIGs. 11 and 12. The completely-cut semiconductor packages SP on the turntable 3226 are picked up by the fourth picker 3232 which, in turn, feeds the picked-up semiconductor packages SP to the second unloading section 5000.

[134] The semiconductor packages SP pass through the washer/dryer 3234 while being fed by the fourth picker 3232. As the semiconductor packages SP passes through the washer/dryer 3234, foreign matter attached to the semiconductor packages SP during the machining process is completely removed from the semiconductor packages SP.

[135] The semiconductor packages SP, for which the washing and drying processes have been completed, are stacked in the drying block 5002 of the second unloading section 5000. The semiconductor packages SP are then completely dried in the drying block 5002.

[136] The completely-dried semiconductor packages SP is picked up by the fifth picker

5006 which, in turn, feeds the picked-up semiconductor packages SP to the seat block 5008. The semiconductor packages SP seated on the seat block 5008 are then fed along the seat block feeding rail 5010.

[137] The semiconductor packages SP, which are fed along the seat block feeding rail

5010, are picked up by the semiconductor package picker 5018 which, in turn, feeds the semiconductor packages SP to the inspector 5020. The semiconductor packages SP inspected by the inspector 5020 are then fed along the semiconductor package feeding rail 5016. Simultaneously, the receiving trays 5024 are fed along the receiving tray feeding line 5026.

[138] The semiconductor packages determined as having a good quality by the inspector 5020 are stacked in the receiving tray 5024 for good-quality products, whereas the semiconductor packages determined as having a poor quality by the inspector 5020 are stacked in the receiving tray 5024 for bad-quality products.

[139] In accordance with the above-described procedures, the operation of the semiconductor strip machining system according to the second embodiment is completed.

[140] Hereinafter, a third embodiment of the semiconductor strip machining system will be described.

[141] As shown in FIG. 14, the semiconductor strip machining system includes a loading section 500 for receiving a plurality of semiconductor strips, and a cutting section 700. The cutting section 700 includes a chuck table unit 702 including chuck tables 704, on

which the semiconductor strips SS will be seated one by one. The chuck tables 704 are movable in X and Y-axis directions. The cutting section 700 also includes a cutting device movably installed to machine the semiconductor strip SS seated on each chuck table 704 into individual semiconductor packages SP. The semiconductor strip machining system also includes a washing/drying section 800 for washing and drying the completely-cut semiconductor packages SP, an inspection section 900 for inspecting whether or not the semiconductor packages SP, which have been completely washed and dried, are defective, an unloading section 950 for receiving the completely-inspected semiconductor packages SP, and a feeding section 600 for picking up the semiconductor strips SS, feeding the picked-up semiconductor strips SS to the loading section 500 or cutting section 700, picking up the semiconductor packages SP, and feeding the picked-up semiconductor packages SP to the washing/ drying section 800, inspection section 900 or unloading section 950.

[142] The loading section 500 includes a plurality of loading magazines 502. In each loading magazine 502, a plurality of semiconductor strips SS to be cut may be stacked. Of course, only one semiconductor strip SS may be stacked in each loading magazine 502.

[143] The loading section 500 also includes a transfer device 504 for feeding the loading magazines 502 one by one. The transfer device 504 may use various driving systems. Preferably, the transfer device 504 uses a belt driving system.

[144] The loading section 500 includes a loader 505. The loader 505 includes a pusher 506. The pusher 506 functions to move, one by one, the semiconductor strips SS stacked in the loading magazine 502, moved to the pusher 506 by the transfer device 504, by pushing one side of each semiconductor strip SS, and thus to cause the semiconductor strips SS to be seated, one by one, on an inlet rail 510.

[145] The loader 505 also includes a gripper 508. The gripper 508 is arranged to face the pusher 506. Accordingly, when the pusher 506 pushes one side of one semiconductor strip SS toward the inlet rail 510, the gripper 508 picks up and pulls the other side of the semiconductor strip SS.

[146] The inlet rail 510 is also included in the loading section 500. In detail, the inlet rail 510 is arranged in a movement path, along which the pusher 506 and gripper 508 move, while being arranged at one side of a movement path, along which a first picker 604 included in the feeding section 600 moves, beneath the movement path of the first picker 604. The first picker 604 will be described later. The inlet rail 510 comprises a pair of rails. The inlet rail 510 functions to temporarily store one semiconductor strip SS before transferring the semiconductor strip SS to cutting section 700.

[147] The feeding section 600 is arranged at one side of the loading section 500. The feeding section 600 includes a feeding rail 602. A first picker 604 is provided at the

feeding rail 602 such that it is movable along the feeding rail 602. The first picker 604 picks up the semiconductor strip laid on the inlet rail 510, and seats the picked-up semiconductor strip on the feeding rail 602, to enable the semiconductor strip to be fed to the chuck table unit 708, which will be described later.

[148] A second picker 606 is also provided at the feeding rail 602. The second picker 606 functions to feed semiconductor packages SP from the cutting section 700 to the washing/drying section 800. The cutting section 700 and washing/drying section 800 will be described later.

[149] A third picker 608 is also provided at the feeding rail 602. The third picker 608 functions to feed the semiconductor packages SP from the washing/drying section 800 to the inspection section 900. The cutting section 700, which machines the semiconductor strips SS, is arranged beneath the central portion of the feeding section 600.

[150] The chuck table unit 702, which is included in the cutting section 700, is arranged to be horizontally movable in X and Y-axis directions. One or more semiconductor strips SS, which are to be machined, are seated on the upper surface of the chuck table unit 702. The cutting unit 720, which is also included in the cutting section 700, can machine one semiconductor strip SS at a point on the semiconductor strip SS or can machine one semiconductor strip SS along a straight line or a curved line on the semiconductor strip SS. The cutting unit 720 can also correct X-axis, Y-axis, and θ positions thereof. The cutting section 700 further includes a sensing unit 730 for acquiring information as to the position of the semiconductor strip SS to be machined, and sending the detected position information to the cutting unit 720, in order to enable the machining position of the cutting unit 720 to be corrected. In accordance with the above-described configuration, the cutting section 720 forms a semiconductor package machining device.

[151] As show in FIG. 14, each of the chuck tables 704, which are included in the chuck table unit 702, functions to support one semiconductor strip SS beneath the semiconductor strip SS. The chuck table unit 702 also includes a chuck table feeder 710 for feeding the chuck tables 704.

[152] Each chuck table 704 functions to hold and support one semiconductor strip SS beneath the semiconductor strip SS during a machining operation carried out by the cutting unit 720. The machining operation of the cutting unit 720 will be described later. It will be appreciated by those skilled in the art that the chuck table 704 may have any structure.

[153] The chuck table feeder 710 includes a first feeding member 712 for feeding the chuck tables 704 in the X-axis direction, and a second feeding member 714 for feeding the chuck tables 704 in the Y-axis direction.

[154] The second feeding member 714 is arranged to be orthogonal to the feeding rail 602.

The second feeding member 714 functions to feed the chuck tables 704 in the Y-axis direction. The first feeding member 712 is arranged to be orthogonal to the second feeding member 714. The first feeding member 712 functions to feed the second feeding member 714 in the X-axis direction.

[155] The second feeding member 714 may comprise several feeding members arranged in parallel. In this embodiment, the second feeding member 714 comprises 4 feeding members, namely, a 2- 1st feeding member 714a, a 2-2nd feeding member 714b, a 2-3rd feeding member 714c, and a 2-4th feeding member 714d.

[156] The cutting unit 720 is arranged above the second feeding member 714 at one side of the second feeding member 714. The cutting unit 720 functions to machine the semiconductor strip SS laid on each chuck table 704.

[157] For the cutting unit 720, various cutting devices may be used. The cutting unit 720 may comprise a laser cutting device, as in the embodiment illustrated in FIG. 1. Also, the cutting unit 720 may comprise a blade, as in the embodiment illustrated in FIG. 15.

[158] The laser cutting device includes a head (not shown) mounted to a tip of the laser cutting device. The head is configured to move under the condition in which the X- axis, Y-axis, and θ positions of the head are controlled by a controller included in the laser cutting device. The laser cutting device functions to machine the semiconductor strip SS shown in FIG. 9 along curved and straight lines, as shown in FIGs. 10 to 12. Of course, it is possible to machine the semiconductor strip SS such that the semiconductor strip SS is cut into individual semiconductor packages SP.

[159] Several laser cutting devices may be used. In this connection, the cutting unit 720 may comprise two cutting units, namely, a first cutting unit 720a and a second cutting unit 720b, as in the embodiment illustrated in FIG. 1.

[160] The first and second cutting units 720a and 720b are arranged over the second feeding member 714. As shown in FIG. 14, the first and second cutting units 720a and 720b may be arranged over the 2- 1st feeding member 714a and 2-3rd feeding member 714c or on the 2-2nd feeding member 714b and 2-4th feeding member 714d, respectively.

[161] The sensing unit 730 is arranged over the second feeding member 714 at one side of the second feeding member 714. The sensing unit 730 includes a vision 732 for sensing the position of the semiconductor strip SS seated on each chuck table 704 coupled to the second feeding member 714. The vision 732 senses the position of the semiconductor strip SS, and sends information as to the sensed position of the semiconductor strip SS to the controller (not shown) of the laser cutting device, in order to enable the head of the laser cutting device to be adjusted in beam emission direction.

[162] A vision rail 734 is arranged above the second feeding member 714 such that the vision rail 734 is orthogonal to the second feeding member 714 while being parallel to

the first feeding member 712. The vision rail 734 allows the vision 732 to move therealong.

[163] For the cutting unit 720, various cutting devices may be used. In this embodiment, the cutting unit 720 comprises only a laser cutting device.

[164] The laser cutting device includes a head mounted to a tip of the laser cutting device. The head is configured to be corrected in position as the X-axis, Y-axis, and θ positions thereof are controlled by a controller included in the laser cutting device. The laser cutting device functions to machine the semiconductor strip SS shown in FIG. 9 along curved and straight lines, as shown in FIGs. 10 to 12.

[165] A scrap box 750 may be arranged beneath the cutting unit 720. The scrap box 750 functions to enable foreign matter, produced when the semiconductor strips SS are cut into semiconductor packages SP in the cutting section 700, to be removed by the weight of the foreign matter.

[166] The washing/drying section 800 is arranged at the side feeding section 600 opposite to the loading section 500. The washing/drying section 800 includes a first washer/ dryer 801 and a second washer/dryer 811.

[167] A washing/drying space 802 is defined in the first washer/dryer 801. The completely - cut semiconductor packages SP are washed and dried in the washing/drying space 802.

[168] The washing/drying section 800 also includes a washing table 804. The washing table 804 is installed to be movable along a washing table feeding rail 805 extending in a longitudinal direction of the washing/drying section 800. The washing table 804 functions to move along the washing stage under the condition in which the semiconductor packages SP are laid on the washing table 804. An air head 806 is arranged in the movement path of the washing table 804. The air head 806 injects air onto the semiconductor packages SP laid on the washing table 804, and thus removes foreign matter attached to the upper surfaces of the semiconductor packages SP. Of course, the air head 806 may also blow hot air, in order to dry the completely-washed semiconductor packages SP.

[169] A water head 808 is also arranged in the movement path of the washing table 804. The water head 808 injects water onto the semiconductor packages SP laid on the washing table 804, and thus removes foreign matter attached to the upper surfaces of the semiconductor packages SP.

[170] In addition, a first brush 810 is arranged in the movement path of the washing table 804. The first brush 810 functions to remove foreign matter attached to the upper surfaces of the semiconductor packages SP laid on the washing table 804.

[171] The second washer/dryer 811 is arranged at one side of the first washer/dryer 801, namely, at one side of the movement path of the third picker 608 of the feeding section 600 beneath the movement path of the third picker 608. The second washer/dryer 811

functions to remove foreign matter attached to the lower surfaces of the semiconductor packages SP.

[172] The second washer/dryer 811 includes a second brush 812. The second brush 812 functions to remove foreign matter attached to the lower surfaces of the semiconductor packages SP fed by the third pickers 608.

[173] The second washer/dryer 811 also includes an air nozzle 813 and a water nozzle 814, to remove foreign matter attached to the lower surfaces of the semiconductor packages SP.

[174] A drying block (not shown) may also be arranged at one side of the washing/drying section 800, namely, at one end of the movement path of the third picker 608 of the feeding section 600. The drying block functions to completely remove foreign matter remaining on the semiconductor packages SP without being removed in the washing/ drying section 800.

[175] The inspection section 900 is arranged at one end of the movement path of the third picker 608 of the feeding section 600. The inspection section 900 includes a first inspector 914 for inspecting the upper surfaces of the completely-cut semiconductor packages SP, and a second inspector 906 for inspecting the lower surfaces of the semiconductor packages SP.

[176] The inspection section 900 also includes an inspection table feeding rail 908 arranged beneath the feeding rail 602 while extending orthogonally to the feeding rail 602. The inspection section 900 further includes an inspection table 910 arranged to be movable along the inspection table feeding rail 908. The inspection table 910 allows semiconductor packages SP to be laid thereof, and feeds the laid semiconductor packages SP along the inspection table feeding rail 908.

[177] A first inspector feeding rail 912 is arranged above the inspection table feeding rail 908 while extending orthogonally to the inspection table feeding rail 908. The first inspector 914 is arranged to be movable along the first inspector feeding rail 912. The first inspector 914 functions to inspect whether or not the upper surface of each semiconductor package SP laid on the inspection table 910 is defective. The second inspector 906 will be described in detail later.

[178] The unloading section 950 is arranged at one side of the inspection section 900. The unloading section 950 includes an unloader feeding rail 952 extending in parallel to the first inspector feeding rail 912. The unloading section 950 also includes a package picker 954 and an unloading picker 956 which are movable along the unloader feeding rail 952.

[179] The package picker 954 picks up the semiconductor packages SP completely inspected in the inspection table 910, and seats the picked-up semiconductor packages SP on an auxiliary table 958, which will be described later. The unloading picker 956

picks up the semiconductor packages SP completely inspected by the second inspector 906, and seats the picked-up semiconductor packages SP on a receiver 960 included in the unloading section 950.

[180] The auxiliary table 958 is arranged in a movement path, along which the package picker 954 and unloading picker 956 move. The auxiliary table 958 is a site for temporarily storing the semiconductor packages SP completely inspected by the first inspector 914.

[181] The second inspector 906 is arranged at one side of the auxiliary table 958. The second inspector 906 functions to inspect whether or not the lower surface of each semiconductor package inspected by the first inspector 914 is defective.

[182] The receiver 960 is arranged in parallel to the auxiliary table 958 beneath the movement path of the unloading picker 956. A certain space is defined in the receiver 960, to provide a site for receiving the semiconductor packages SP completely inspected in the inspection section 900.

[183] Several receivers 960 may be provided. Preferably, at least two receivers 960 are provided. That is, it is preferred that the unloading section 950 includes a receiver 960 for receiving the semiconductor packages SP determined as having a poor quality by the inspection section 900, and a receiver 960 for receiving the semiconductor packages SP determined as having a normal quality by the inspection section 900.

[184] Meanwhile, an unloading picker rail 962 is also arranged to feed the unloading picker 956, which moves along the unloader feeding rail 952. In detail, the unloading picker rail 962 is arranged to be orthogonal to the unloader feeding rail 952 such that it is movable along the unloader feeding rail 952. The unloading picker 956 is movable along the unloading picker rail 962.

[185] That is, the unloading picker 956 is movable in the X-axis direction along the unloader feeding rail 952 while being movable in the Y-axis direction along the unloading picker rail 962.

[186] Hereinafter, the operation of the third embodiment of the semiconductor strip machining system according the present invention will be described.

[187] When one semiconductor strip SS is seated on one loading magazine 502 of the loading section 500, the first transfer device 504 operates to move the loading magazine 502 to the pusher 506. The pusher 506 operates when the loading magazine 502 is aligned with the movement direction of the pusher 506. In accordance with the operation of the pusher 506, one semiconductor strip SS is moved to the first picker rail 605 of the first picker 604.

[188] When the semiconductor strip SS moves to the first picker rail 605, the first gripper 508 picks up the side of the semiconductor strip SS opposite to the pusher 506, and pulls the semiconductor strip SS toward the first picker rail 605. That is, the semi-

conductor strip SS is seated on the first picker rail 605 in accordance with the cooperation of the pusher 506 and first gripper 508.

[189] When the semiconductor strip SS is seated on the first picker rail 506, the first picker 604 moves along the feeding rail 602 of the feeding section 600 to the cutting section 700. When the first picker 604 reaches the cutting section 700, the chuck table 708 of the cutting section 700 is positioned beneath the first picker 604.

[190] The first picker 604 then seats the picked-up semiconductor strip SS on one chuck table 704 of the chuck table unit 702. In the same manner, another semiconductor strip SS is seated on another chuck table 704 of the chuck table unit 702. Once the semiconductor strips SS are seated on the chuck table unit 702 in the above-described manner, the associated chuck tables 704 move in the Y-axis direction along the second feeding member 714.

[191] The chuck tables 704 passes through the sensing unit 730 while moving in the Y-axis direction along the second feeding member 714. At this time, the vision 732 of the sensing unit 730 acquires information as to the position of the semiconductor strip SS seated on each of the moved chuck tables 704, and sends the acquired information to the controller of the cutting unit 720.

[192] After receiving the information, the controller corrects the position of the head of the cutting unit 720, based on the information. In this case, the sensing unit 730 senses the positions of the semiconductor strips SS seated on the chuck tables 704 coupled to the 2-2nd and 2-4th feeding members 714b and 714d because the first and second cutting units 720a and 720b constituting the cutting unit 720 are arranged over the 2-2nd and 2-4th feeding members 714b and 714d, respectively, as shown in FIG. 14.

[193] When the cutting process for the semiconductor strips SS on the chuck tables 704 of the 2-2nd and 2-4th feeding members 714b and 714d is completed, the chuck tables 704 move in the X-axis direction along the first feeding member 712. Subsequently, the chuck tables 704 of the 2- 1st and 2-3rd feeding members 714a and 714c are positioned beneath the cutting unit 720.

[194] Thus, the cutting of the semiconductor strips SS on all chuck tables 704 can be completed. After the completion of the cutting of the semiconductor strips SS, the chuck tables 704 are returned to original positions thereof by the chuck table feeder 710.

[195] When all chuck tables 704 are positioned to the original positions thereof, the second picker 606 moves to a region defined over the chuck tables 704, in order to feed the semiconductor strips SS to the first washer/dryer 801. The second picker 606 then picks up the completely-cut semiconductor packages, and seats the picked-up semiconductor packages to the washing table 804.

[196] Once the semiconductor packages are seated on the washing table 804, the washing

table 804 moves to the washing/drying space 802. First, the washing table 804 passes through the air head 806, to allow foreign matter attached to the semiconductor packages to be removed by air. The washing table 804 then passes through the water head 808, to allow the semiconductor packages to be washed by water.

[197] At this time, the first brush 810 removes foreign matter attached to the semiconductor packages while moving along the upper surface of the washing table 804, namely, along the upper surfaces of the semiconductor packages.

[198] After passing through the first brush 810, the washing table 804 again passes through the water head 808, to allow the semiconductor packages to be washed by water, and then again passes through the air head 806, to allow the semiconductor packages to be washed and dried by air.

[199] After completion of the washing process carried out in the first washer/dryer 801, the washing table 804 is returned to the original position thereof. At this time, the third picker 608 moves to a region defined over the washing table 804. The third picker 608 then picks up the semiconductor packages, and moves to the second washer/dryer 811. The third picker 608 moves along the feeding rail 602. During this movement, the third picker 608 sequentially passes through the second brush 812, air nozzle 813, and water nozzle 814, in this order.

[200] Also, moisture present on the semiconductor packages SP is completely removed by the drying block provided at the second washer/dryer 811.

[201] Thereafter, the third picker 608 seats the semiconductor packages on the inspection table 910.

[202] Once the semiconductor packages are seated on the inspection table 910, the inspection table 910 moves, along the inspection table feeding rail 908, to a region defined beneath the first inspector 914. At this time, the first inspector 914 determines whether or not the upper surface of each semiconductor package seated on the inspection table 910 is defective, while moving along the first inspector feeding rail 912.

[203] After passing through the first inspector 914, the washing table 804 is returned to the original position thereof. Subsequently, the package picker 954 picks up the semiconductor packages on the washing table 804, and feeds the picked-up semiconductor packages to the auxiliary table 958, while moving along the unloader feeding rail 952.

[204] Once the semiconductor packages are seated on the auxiliary table 958, the unloading picker 956 picks up the semiconductor packages seated on the auxiliary table 958 while moving along the unloader feeding rail 952. The unloading picker 956 then moves to the second inspector 906 along the unloading picker rail 962.

[205] The second inspector 906 determines whether or not the lower surface of each semiconductor package picked up by the unloading picker 956 is defective. The unloading

picker 956 then feeds the semiconductor packages to the receivers 960 while moving along the unloader feeding rail 952.

[206] At this time, the semiconductor packages determined as having a good quality by the inspection section 900 are stacked in the receiver 960 for good-quality products, whereas the semiconductor packages determined as having a poor quality by the inspection section 900 are stacked in the receiver 960 for bad-quality products.

[207] Hereinafter, a configuration of the fourth embodiment of the semiconductor strip machining system according to the present invention will be described.

[208] Referring to FIG. 15, the fourth embodiment of the semiconductor strip machining system is illustrated. The semiconductor strip machining system shown in FIG. 15 includes a loading section 6100 for receiving an article to be machined, and loading the article in a loading stage, a cutting section 6300 for machining the loaded article, and a washing/drying section 6400 for washing and drying the completely-machined article.

[209] The loading section 6100 includes a plurality of loading magazines 6102. In each loading magazine 6102, a plurality of semiconductor strips SS to be machined may be stacked in the form of cassette magazines. Of course, only one semiconductor strip SS may be stacked in each loading magazine 6102.

[210] The loading section 6100 also includes a transfer device 6104 for feeding the loading magazines 6102 one by one. The transfer device 6104 may use various driving systems. Preferably, the transfer device 6104 uses a belt driving system.

[211] A loader 6105 is arranged at one end of the transfer device 6104. The loader 6105 includes a pusher 6106. The pusher 6106 functions to move, one by one, the semiconductor strips SS stacked in the loading magazine 6102 moved to the pusher 6106 by the transfer device 6104 by pushing one side of each semiconductor strip SS, and thus to cause the semiconductor strips SS to be seated, one by one, on an inlet rail 6112, which will be described later.

[212] The loader 6105 also includes a gripper 6110. The gripper 6110 is arranged at one side of the loading magazine 6102 such that it faces the pusher 6106. Accordingly, when the pusher 6106 pushes one side of one semiconductor strip SS toward the inlet rail 6112, the gripper 6110 picks up and pulls the other side of the semiconductor strip SS, to enable the semiconductor strip SS to be easily fed.

[213] The loader 6105 also includes the inlet rail 6112. The inlet rail 6112 is arranged in a movement path, along which the pusher 6106 and gripper 6110 move. The inlet rail 6112 comprises a pair of rails. The inlet rail 6112 allows one semiconductor strip SS to be laid thereon.

[214] The feeding section 6200 is arranged to be orthogonal to the loading section 6100. The feeding section 6200 functions to feed semiconductor strips SS from the loading section 6100 to the washing/drying section 6400. The feeding section 6200 includes a

feeding rail 6202. A first picker 6204 and a second picker 6206 are arranged over the feeding rail 6202 such that they are movable along the feeding rail 6202.

[215] Preferably, the first picker 6204 is arranged over the feeding rail 6202 adjacent to the loading section 6100. In this case, the first picker 6204 can easily pick up one semiconductor strip SS, and can easily feed the picked-up semiconductor strip SS to a chuck table 6304, which will be described later.

[216] Preferably, the second picker 6206 is arranged over the feeding rail 6202 adjacent to the washing/drying section 6400. In this case, the second picker 6206 can easily pick up one semiconductor strip SS, and can easily feed the picked-up semiconductor strip SS to the washing/drying section 6400.

[217] The cutting section 6300, which machines one or more semiconductor strips SS, is arranged beneath a central portion of the feeding rail 6202.

[218] The cutting section 6300 includes a chuck table unit 6302 installed to be horizontally movable in an Y-axis direction while being rotatable. One or more semiconductor strips SS, which are to be machined, are seated on the upper surface of the chuck table unit 6302. The cutting section 6300 also includes a cutting unit 6320 for machining one semiconductor strip SS along a straight line on the semiconductor strip SS. The cutting unit 6320 is movable in an X-axis direction. The cutting section 6300 further includes a sensing unit 6330 for acquiring information as to the position of the semiconductor strip SS to be machined, and sending the detected position information to the chuck table unit 6302 and cutting unit 6320, in order to enable the position of the cutting unit 6320 to be corrected. In accordance with the above-described configuration, the cutting section forms a semiconductor package machining device.

[219] Of course, the semiconductor package machining device may be used as a machining device for machining an article other than the semiconductor strip. For example, the machining device can be used to form a certain mark on an article.

[220] As show in FIG. 15, the chuck table unit 6302 includes chuck tables 6304 each adapted to support one semiconductor strip SS beneath the semiconductor strip SS, and a chuck table feeder 6306 for feeding the chuck tables 6304.

[221] Each chuck table 6304 functions to hold and support one semiconductor strip SS beneath the semiconductor strip SS during a machining operation carried out by the cutting unit 6320. The machining operation of the cutting unit 6320 will be described later. It will be appreciated by those skilled in the art that the chuck table 6304 may have any structure.

[222] The chuck table feeder 6310 includes a first feeding member 6312 for feeding the chuck tables 6304 in the X-axis direction, a second feeding member 6314 for feeding the chuck tables 6304 in the Y-axis direction, and rotating members 6315 for rotating the chuck tables 6304.

[223] The second feeding member 6314 is arranged to be orthogonal to the feeding rail

6202. The second feeding member 6314 functions to feed the chuck tables 6304 in the Y-axis direction. The first feeding member 6312 is arranged to be orthogonal to the second feeding member 6314. The first feeding member 6312 functions to feed the second feeding member 6314 in the X-axis direction.

[224] The second feeding member 6314 may comprise several feeding members arranged in parallel. In this embodiment, the second feeding member 6314 comprises 4 feeding members, namely, a 2- 1st feeding member 6314a, a 2-2nd feeding member 6314b, a 2-3rd feeding member 6314c, and a 2-4th feeding member 6314d.

[225] The rotating members 6315 are provided at respective chuck tables 6304, to rotate the associated chuck tables 6304. Since the cutting unit 6320 is fixed, each rotating member 6315 rotates the associated chuck table 6304 with respect to the cutting unit 6320 during a cutting operation of the cutting unit 6320, in order to machine the semiconductor strip into various shapes.

[226] The cutting unit 6320 is arranged above the second feeding member 6314 at one side of the second feeding member 6314. The cutting unit 6320 functions to machine the semiconductor strip SS laid on each chuck table 6304.

[227] For the cutting unit 6320, various cutting devices may be used. In the embodiment illustrated in FIG. 15, the cutting unit 6320 may comprise a blade.

[228] The blade functions to machine the semiconductor strip SS shown in FIG. 11 or 12 along a straight line. Of course, the semiconductor strip SS may be machined to be cut into individual semiconductor packages SP.

[229] Several blades may be used. In the embodiment illustrated in FIG. 15, two pairs of blades are used to constitute a first cutting unit 6320a and a second cutting unit 6320b, respectively.

[230] The first and second cutting units 6320a and 6320b are arranged over the second feeding member 6314. As shown in FIG. 1, the first and second cutting units 6320a and 6320b may be arranged over the 2- 1st feeding member 6314a and 2-3rd feeding member 6314c or on the 2-2nd feeding member 6314b and 2-4th feeding member 6314d, respectively.

[231] The sensing unit 6330 is arranged over the second feeding member 6314 at one side of the second feeding member 6314.

[232] The sensing unit 6330 includes a vision 6332 for sensing the position of the semiconductor strip SS seated on each chuck table 6304 coupled to the second feeding member 6314. The vision 6332 senses the position of the semiconductor strip SS, and sends information as to the sensed position of the semiconductor strip SS to the controller (not shown) of the laser cutting device, in order to enable the adjustment of the Y-axis and θ positions of the associated chuck table 6304 and the adjustment of the

X-axis position of the associated blades.

[233] A vision rail 6334 is arranged above the second feeding member 6314 such that the vision rail 6334 is orthogonal to the second feeding member 6314 while being parallel to the first feeding member 6312. The vision rail 6334 allows the vision 6332 to move therealong.

[234] The washing/drying section 6400 is arranged in the movement path of the second picker 6206. The washing/drying section 6400 functions to remove foreign matter from semiconductor packages SP produced after the machining of each semiconductor strip. A drying block 6500 is arranged at one side of the washing/drying section 6400. The drying block 6500 functions to remove moisture, etc. remaining on the semiconductor packages after the washing operation of the washing/drying section 6400.

[235] The operation of the fourth embodiment of the semiconductor strip machining system according the present invention having the above-described configuration will be described in detail.

[236] When one semiconductor strip SS is seated on one loading magazine 6102 of the loading section 6100, as shown in FIG. 15, the transfer device 6104 operates to move the loading magazine 6102 to the pusher 6106.

[237] The pusher 6106 operates when the loading magazine 6102 is aligned with the movement direction of the pusher 6106. In accordance with the operation of the pusher 6106, one semiconductor strip SS is moved to the inlet rail 6112.

[238] When the semiconductor strip SS moves to the inlet rail 6112, the gripper 6110 picks up the side of the semiconductor strip SS opposite to the pusher 6106, and pulls the semiconductor strip SS toward the inlet rail 6112. That is, the semiconductor strip SS is seated on the inlet rail 6112 in accordance with the co-operation of the pusher 6106 and gripper 6110.

[239] When the semiconductor strip SS is seated on the inlet rail 6112, the first picker 6204 moves along the feeding rail 6202, and picks up the semiconductor strip SS seated on the inlet rail 6112. The first picker 6204 then seats the picked-up semiconductor strip SS on the chuck table 6304 arranged on one of the 2-2nd feeding member 6314b and 2-4th feeding member 6314d. Subsequently, the first picker 6204 seats another semiconductor strip SS, fed in the same manner as described above, on the chuck table 6304 arranged on the other one of the 2-2nd feeding member 6314b and 2-4th feeding member 6314d. Of course, the first picker 6204 may seat the picked-up semiconductor strips SS on the chuck tables 6304 arranged on the 2- 1st feeding member 6314a and 2-3rd feeding member 6314c.

[240] When the semiconductor strips SS are seated on the chuck tables 6304 coupled to the 2-2nd feeding member 6314b and 2-4th feeding member 6314d, respectively, the chuck tables 6304 move in the Y-axis direction along the associate feeding members of

the second feeding member 6314.

[241] As the chuck tables 6304 move in the Y-axis direction along the second feeding member 6314, they pass through the sensing unit 6330. At this time, the vision 6332 of the sensing unit 6330 acquires information as to the position of the semiconductor strip SS seated on each of the moved chuck tables 6304, and sends the acquired information to the controller of the cutting unit 6320.

[242] The position information is acquired as the vision 6332 of the sensing unit 6330 detects the position of a specific mark provided at a certain position on the semiconductor strip SS. Based on the position information, it is possible to determine the position of the semiconductor strip SS.

[243] After receiving the information, the controller corrects the positions of the chuck tables of the cutting unit 6320 and the positions of the blades, based on the information. In this case, the sensing unit 6330 senses the positions of the semiconductor strips SS seated on the chuck tables 6304 coupled to the 2-2nd and 2-4th feeding members 6314b and 6314d because the cutting unit 6320 is arranged over the 2-2nd and 2-4th feeding members 6314b and 6314d, as shown in FIG. 15.

[244] Meanwhile, during the machining process for the semiconductor strips SS on the chuck tables 6304 of the 2-2nd and 2-4th feeding members 6314b and 6314d, semiconductor strips SS are seated on the chuck tables 6304 of the 2- 1st and 2-3rd feeding members 6314a and 6314c.

[245] When the machining process for the semiconductor strips SS on the chuck tables 6304 of the 2-2nd and 2-4th feeding members 6314a and 6314c is completed, the feeding members constituting the second feeding member 6314 are simultaneously moved in the X-axis direction by the first feeding member 6312. As a result, the chuck tables 6304 of the 2- 1st and 2-3rd feeding members 6314a and 6314c are positioned beneath the cutting unit 6320.

[246] Also, the semiconductor strip SS seated on each chuck table 6304 is cut into a shape desired by the user in accordance with the rotation of the associated rotating member 6315, as shown in FIG. 15.

[247] In the above-described manner, the semiconductor strips SS on all chuck tables 6304 are machined into semiconductor packages. After the completion of the cutting of the semiconductor strips SS, the chuck tables 6304 are returned to original positions thereof by the chuck table feeder 6310.

[248] When all chuck tables 6304 are positioned to the original positions thereof, the second picker 6206 moves along the feeding rail 6202 to a region defined over the chuck tables 6304. The second picker 6206 then picks up the semiconductor packages SP, and feeds the picked-up semiconductor packages SP to the washing/drying section 6400.

[249] In the washing/drying section 6400, the semiconductor packages SP are washed and dried. Also, moisture, etc. remaining on the semiconductor packages are completely removed by the drying block 6500 arranged at one side of the washing/drying section 6400.

[250] Hereinafter, a configuration of the fifth embodiment of the semiconductor strip machining system according to the present invention will be described.

[251] As shown in FIG. 16, the semiconductor strip machining system mainly includes a loading section 7100 for loading a semiconductor strip, a cutting section 7300 for cutting the loaded semiconductor strip into semiconductor packages, an unloading section 7400 for unloading the semiconductor packages, and a feeding section 7200 for feeding the semiconductor strip to the loading section 7100 or cutting section 7300, and feeding the semiconductor packages to the unloading section 7400.

[252] The loading section 7100 includes a plurality of loading magazines 7102. In each loading magazine 7102, a plurality of semiconductor strips SS to be machined may be stacked in the form of cassette magazines. Of course, only one semiconductor strip SS may be stacked in each loading magazine 7102.

[253] The loading section 7100 also includes a first transfer device 7104 for feeding the loading magazines 7102 one by one. The first transfer device 7104 may use various driving systems. Preferably, the first transfer device 7104 uses a belt driving system.

[254] A pusher 7106 is arranged at one end of the first transfer device 7104. The pusher

7106 functions to move, one by one, the semiconductor strips SS stacked in the loading magazine 7102 moved to the first pusher 7106 by the first transfer device 7104 by pushing one side of each semiconductor strip SS, and thus to cause the semiconductor strips SS to be seated, one by one, on a first picker rail 7206, which will be described later.

[255] The feeding section 7200 is arranged at one side of the loading section 7100. The feeding section 7200 includes a feeding rail 7202, and a first picker 7204 arranged to be movable along the feeding rail 7202. The first picker 7204 picks up the semiconductor strips SS loaded in the loading section 7100 one by one, and feeds the picked-up semiconductor strip SS to a chuck table 7316, which will be described later.

[256] The first picker 7204 includes a first picker rail 7206. The first picker rail 7206 comprises a pair of rails. The first picker rail 7206 functions to allow one semiconductor strip to be laid thereon during the movement of the first picker 7204.

[257] The first picker 7204 also includes a first gripper 7208. The first gripper 7208 is arranged to fact the pusher 7106. Accordingly, when the pusher 7106 pushes one side of one semiconductor strip SS toward the first picker rail 7206, the first gripper 7208 picks up and pulls the other side of the semiconductor strip SS.

[258] The first picker 7204 also includes a sensing unit 7210. The sensing unit 7210 for

acquiring information as to the position of the semiconductor strip SS seated on the chuck table 7316, which will be described later, and sending the detected position information to the cutting section 7300.

[259] The cutting section 7300 is arranged beneath a central portion of the feeding rail

7202. The cutting section 7300 includes a chuck table feeding rail 7302 arranged to be orthogonal to the feeding rail 7202.

[260] A chuck table unit 7304 is installed on the chuck table feeding rail 7302 such that it is movable along the chuck table feeding rail 7302. The chuck table unit 7304 includes at least one chuck table 7316. The chuck table 7316 is fed by the chuck table unit 7304. The chuck table unit 7304 also includes a driving body 7306. The driving body 7306 includes a horizontal driver 7308 and a vertical driver 7310. The horizontal driver 7308 includes a driver such as a motor, in order to horizontally move the chuck table 7316 along the chuck table feeding rail 7302. Of course, the horizontal driver 7308 may be configured to move the chuck table 7316 in the X and Y-axis directions along the chuck table feeding rail 7302.

[261] The vertical driver 7310 includes a vertical guide 7312. The vertical guide 7312 functions to guide the chuck table 7316 to move vertically. Similarly to the horizontal driver 7308, the vertical driver 7310 also includes a driver to vertically move the chuck table 7316.

[262] At least one support 7314 is arranged at one side of the vertical guide 7312 such that it is orthogonal to the vertical guide 7312. The support 7314 allows the chuck table 7316 to be laid thereon. The support 7314 can receive the vertical driver 7310, and thus can move vertically along the vertical guide 7312.

[263] The chuck table 7316 is arranged on the support 7314. The chuck table 7316 functions to support the semiconductor strip seated thereon, beneath the semiconductor strip, when the semiconductor strip is cut by a cutting unit 7318, which will be described later. It will be appreciated by those skilled in the art that the chuck table 7316 may have any structure.

[264] Several chuck tables 7316 may be supported by one support 7314. In the illustrated embodiment of the present invention, two chuck tables 7316 are arranged in parallel on the support 7314 such that they meet the number of cutting units 7318, which will be described later.

[265] As shown in FIG. 17, a pair of chuck table feeding rails 7302 may be provided. In this case, a pair of chuck table units 7304, which are movable along respective chuck table feeding rails 7302, may be provided. It is possible to prevent the chuck table units 7304 from interfering with each other during the movements thereof by configuring them such that they are vertically movable, as described above. For the convenience of description, the following description will be given only in conjunction with one

cutting unit 7318.

[266] The cutting unit 7318 is arranged above the chuck table unit 7304 in a movement path, along which the chuck table unit 7304 move along the chuck table feeding rail 7302. The cutting unit 7318 functions to cut the semiconductor strip seated on the chuck table 7316 into semiconductor packages.

[267] For the cutting unit 7318, various cutting devices may be used. The cutting unit 7318 may comprise only a laser cutting device. Also, the cutting unit 7318 may comprise a laser cutting device and a blade. The following description will be described only in conjunction with the case in which the cutting unit 7318 comprises only a laser cutting device. The laser cutting device includes a head 7320 mounted to a tip of the laser cutting device. The head 7320 is configured to be corrected in position as the X-axis, Y-axis, and θ positions of the head 7320 are controlled by a controller (not shown) included in the laser cutting device. The laser cutting device functions to machine the semiconductor strip SS shown in FIG. 10 along curved and straight lines.

[268] Several laser cutting devices may be used. In this embodiment, it is preferred that two laser cutting devices be used because two chuck tables 7316 are arranged in parallel.

[269] The unloading section 7400 is arranged at the side of feeding rail 7202 opposite to the loading section 7100. The unloading section 7400 includes a plurality of unloading magazines 7402. In each unloading magazine 7402, a plurality of completely- machined semiconductor strips SS may be stacked. Of course, only one semiconductor strip SS may be stacked in each unloading magazine 7402.

[270] The unloading section 7400 also includes a second transfer device 7404 for feeding the unloading magazines 7402 one by one. The second transfer device 7404 may use various driving systems. Preferably, the second transfer device 7404 uses a belt driving system.

[271] A second picker 7202 is arranged over the feeding rail 7202 of the feeding section 7200, to pick up and feed the completely-cut semiconductor packages. The second picker 7212 includes a second picker rail 7214. The second picker rail 7214 comprises a pair of rails. The second picker rail 7214 functions to support one semiconductor strip beneath the semiconductor strip during the movement of the second picker 7212.

[272] A second gripper 7216 is arranged over the second picker rail 7214. The second gripper 7216 functions to seat, on one unloading magazine 7402, the semiconductor strip laid on the second picker rail 7214.

[273] The operation of the fifth embodiment of the semiconductor strip machining system according the present invention will be described.

[274] When one semiconductor strip SS is seated on one loading magazine 7102 of the loading section 7100, the first transfer device 7104 operates to move the loading

magazine 7102 to the first pusher 7106. When the loading magazine 7102 is aligned with the movement direction of the first pusher 7106, the first pusher 7106 operates to move one semiconductor strip SS to the first picker rail 7206.

[275] When the semiconductor strip SS moves to the first picker rail 7206, the first gripper 7208 picks up the side of the semiconductor strip SS opposite to the first pusher 7106, and pulls the semiconductor strip SS toward the first picker rail 7206. That is, the semiconductor strip SS is seated on the first picker rail 7206 in accordance with the cooperation of the first pusher 7106 and first gripper 7208.

[276] When the semiconductor strip SS is seated on the first picker rail 7206, the first picker 7204 moves along the feeding rail 7202 of the feeding section 7200 to the cutting section 7300. When the first picker 7204 reaches the cutting section 7300, the chuck table unit 7304 of the cutting section 7300 is positioned beneath the first picker 7204.

[277] The first picker 7204 then seats the semiconductor strip on the chuck table unit 7304. When the semiconductor strip is seated on the chuck table unit 7304, the sensing unit 7210 of the first picker 7204 is positioned over the chuck table unit 7304.

[278] The sensing unit 7210 acquires information as to the position relation between the semiconductor strip SS and the chuck table 7316, and sends the acquired information to the controller of the cutting section 7300.

[279] After receiving the information, the cutting section 7300 corrects the position of the head 7320 of the cutting unit 7318, based on the information. Thereafter, the chuck table unit 7304 moves along the chuck table feeding rail 7301 to a region defined beneath the cutting unit 7318.

[280] Once the chuck table unit 7304 is positioned beneath the cutting unit 7318, the cutting unit 7318 operates to cut the semiconductor strip on the chuck table unit 7304. After the completion of the cutting of the semiconductor strip, the chuck table unit 7304 is returned to the original position thereof along the chuck table feeding rail 7302.

[281] When the chuck table 7304 is positioned to the original position thereof, the second picker 7212 moves to a region defined over the chuck table 7316. The second picker 7212 then picks up the completely-cut semiconductor strip SS, and seats the picked-up semiconductor strip SS to the second picker rail 7214.

[282] When the semiconductor strip SS is seated on the second picker rail 7214, the second gripper 414 pushes the semiconductor strip SS into one unloading magazine 7402. When the semiconductor strip SS is seated on the unloading magazine 7402, the second transfer device 7404 operates to transfer the semiconductor strip SS to the next stage. Thus, the machining operation of the semiconductor strip machining system according to the present invention is completed.

[283] It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention cover the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents. Industrial Applicability

[284] The above-described semiconductor strip machining system according to the present invention has the following effects.

[285] First, since the semiconductor strip machining system includes a cutting unit, which comprises a laser cutting device, it is possible to cut a semiconductor strip into semiconductor packages having various shapes, and thus to meet diverse user's demands.

[286] Also, since the semiconductor strip machining system additionally includes a sensing unit for sensing the position of the semiconductor strip seated on a chuck table, it is possible to correct the position of the cutting unit, based on information acquired by the sensing unit, and thus to prevent production of defective products. Thus, an enhancement in productivity is achieved.