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Patent Searching and Data


Title:
MACHINING CONTROL SYSTEM AND MOTION GUIDE DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/139236
Kind Code:
A1
Abstract:
The purpose of the invention is to suppress deterioration in machining precision when a machining device performs machining on a workpiece in a state where the workpiece is movably supported by a motion guide device. Disclosed is a machining control system related to the machining of a workpiece performed by a machining device in a state where the workpiece is movably supported by a motion guide device that includes: a track member extending along a length direction; and a movement member that is arranged so as to oppose the track member via a rolling body arranged so as to be rollable inside a rolling groove, and that is relatively movable along the length direction of the track member. The machining control system comprises: an acquisition unit that acquires predetermined machining information related to a load applied to the motion guide device when the machining device performs machining on the workpiece; and an output unit that, on the basis of the predetermined machining information acquired by the acquisition unit, generates machining correction information for correcting a predetermined control parameter for machining the workpiece by the machining device, and outputs the machining correction information to the machining device side.

Inventors:
UNNO AKIHIRO (JP)
HAYASHI YUKI (JP)
TANAKA YUKI (JP)
OHASHI TOMOFUMI (JP)
ASANO YUSUKE (JP)
KOGURE KATSUNORI (JP)
Application Number:
PCT/JP2018/000869
Publication Date:
August 02, 2018
Filing Date:
January 15, 2018
Export Citation:
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Assignee:
THK CO LTD (JP)
International Classes:
G05B19/404; F16C29/06; F16C41/00; G05B19/416
Foreign References:
JPH05288216A1993-11-02
JP2011226956A2011-11-10
JP2015218888A2015-12-07
JP2003108206A2003-04-11
JP2009009614A2009-01-15
Attorney, Agent or Firm:
HIRAKAWA, Akira et al. (JP)
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