Title:
MACHINING CONTROL SYSTEM AND MOTION GUIDE DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/139236
Kind Code:
A1
Abstract:
The purpose of the invention is to suppress deterioration in machining precision when a machining device performs machining on a workpiece in a state where the workpiece is movably supported by a motion guide device. Disclosed is a machining control system related to the machining of a workpiece performed by a machining device in a state where the workpiece is movably supported by a motion guide device that includes: a track member extending along a length direction; and a movement member that is arranged so as to oppose the track member via a rolling body arranged so as to be rollable inside a rolling groove, and that is relatively movable along the length direction of the track member. The machining control system comprises: an acquisition unit that acquires predetermined machining information related to a load applied to the motion guide device when the machining device performs machining on the workpiece; and an output unit that, on the basis of the predetermined machining information acquired by the acquisition unit, generates machining correction information for correcting a predetermined control parameter for machining the workpiece by the machining device, and outputs the machining correction information to the machining device side.
Inventors:
UNNO AKIHIRO (JP)
HAYASHI YUKI (JP)
TANAKA YUKI (JP)
OHASHI TOMOFUMI (JP)
ASANO YUSUKE (JP)
KOGURE KATSUNORI (JP)
HAYASHI YUKI (JP)
TANAKA YUKI (JP)
OHASHI TOMOFUMI (JP)
ASANO YUSUKE (JP)
KOGURE KATSUNORI (JP)
Application Number:
PCT/JP2018/000869
Publication Date:
August 02, 2018
Filing Date:
January 15, 2018
Export Citation:
Assignee:
THK CO LTD (JP)
International Classes:
G05B19/404; F16C29/06; F16C41/00; G05B19/416
Foreign References:
JPH05288216A | 1993-11-02 | |||
JP2011226956A | 2011-11-10 | |||
JP2015218888A | 2015-12-07 | |||
JP2003108206A | 2003-04-11 | |||
JP2009009614A | 2009-01-15 |
Attorney, Agent or Firm:
HIRAKAWA, Akira et al. (JP)
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