Title:
MACHINING DEVICE FOR PLATE MATERIAL MACHINING, AND MACHINING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/090872
Kind Code:
A1
Abstract:
[Problem] To provide a machining device and a machining method that can minimize fractured surfaces in the plate width face of punched plate material and that can prevent burrs. [Solution] A lower punch 5 is raised by 20 to 70% of the thickness of a metal plate 20 and the lower punch 5 is pressed into the metal plate 20 in a first partial removal step. An upper punch 2 is held in a position that is not in contact with the surface of the metal plate 20. Next, the lower punch 5 is moved down, and the first partial removal step is completed. In a second partial removal step, the upper punch 2 is moved down as shown in FIG. 3(A) and is lowered by 20 to 70% of the thickness of the metal plate 20 as shown in FIG. 3(B), and the upper punch 2 is pressed into the metal plate 20. The lower punch 5 moves to a position lower than the bottom face of a punched part 21. Next, the upper punch 2 is raised as shown in FIG. 3(C), and the second partial removal step is completed. The punched part 21 is in a state of being engaged with a punched hole 22 and is held in the metal plate 20 without dropping through the punched hole 22.
Inventors:
TAKEUCHI SHINOBU (JP)
Application Number:
PCT/JP2019/042528
Publication Date:
May 07, 2020
Filing Date:
October 30, 2019
Export Citation:
Assignee:
TAKEUCHI SHINOBU (JP)
International Classes:
B21D28/00; B21D28/10; B21D28/16; B21D28/24; B21D28/34
Foreign References:
| JP2012110933A | 2012-06-14 | |||
| JPS5785623A | 1982-05-28 | |||
| JP2011526212A | 2011-10-06 | |||
| JPS305896B |
Attorney, Agent or Firm:
IP-FOCUS PATENT OFFICE (JP)
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