MACHINING DEVICE

WIPO Patent Application WO/2011/135619

A1

Disclosed is a machining device (1) which comprises a first mold (12) and a second mold (11) which is disposed so as to face the first mold (12). The first mold (12) is configured to enable at least two states thereof, which are: a machining force action state wherein the first mold (12) approaches the second mold (11) to make a machining force act on a workpiece; and a machining preparation state wherein the first mold (12) is separated from the second mold (11) further than during the machining force action state. The machining device (1) comprises: a machining force generation device (13) for driving the first mold (12), which is in the machining force action state, in a direction approaching the second mold (11) to make the machining force act on the workpiece; and a mold travel device (14) for moving the first mold (12) from the machining preparation state until the first mold (12) reaches the machining force action state.

JP55077933	BENDING METHOD FOR PIPE
JP3966548	PIPE BENDING APPARATUS
JP59019034	BENDING OF MATERIAL

TOMINAGA, Makoto (5-2-1 Ishiuchiminami, Saeki-ku, Hiroshima-sh, Hiroshima 97, 〒7315197, JP)
冨永誠 (〒97 広島県広島市佐伯区石内南５丁目２番１号　株式会社ヒロテック内 Hiroshima, 〒7315197, JP)

JP2010/003026

November 03, 2011

April 27, 2010

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HIROTEC CORPORATION (5-2-1, Ishiuchiminami Saeki-ku, Hiroshima-sh, Hiroshima 97, 〒7315197, JP)
株式会社ヒロテック (〒97 広島県広島市佐伯区石内南５丁目２番１号 Hiroshima, 〒7315197, JP)
TOMINAGA, Makoto (5-2-1 Ishiuchiminami, Saeki-ku, Hiroshima-sh, Hiroshima 97, 〒7315197, JP)

B21D7/04; B21D39/02

MAEDA, Hiroshi et al. (Osaka-Marubeni Bldg, 5-7 Hommachi 2-chome, Chuo-ku, Osaka-sh, Osaka 53, 〒5410053, JP)

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