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Patent Searching and Data


Title:
MACHINING DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/135619
Kind Code:
A1
Abstract:
Disclosed is a machining device (1) which comprises a first mold (12) and a second mold (11) which is disposed so as to face the first mold (12). The first mold (12) is configured to enable at least two states thereof, which are: a machining force action state wherein the first mold (12) approaches the second mold (11) to make a machining force act on a workpiece; and a machining preparation state wherein the first mold (12) is separated from the second mold (11) further than during the machining force action state. The machining device (1) comprises: a machining force generation device (13) for driving the first mold (12), which is in the machining force action state, in a direction approaching the second mold (11) to make the machining force act on the workpiece; and a mold travel device (14) for moving the first mold (12) from the machining preparation state until the first mold (12) reaches the machining force action state.

Inventors:
TOMINAGA MAKOTO (JP)
YAMANAKA TAKAYUKI (JP)
Application Number:
PCT/JP2010/003026
Publication Date:
November 03, 2011
Filing Date:
April 27, 2010
Export Citation:
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Assignee:
HIROTEC CORP (JP)
TOMINAGA MAKOTO (JP)
YAMANAKA TAKAYUKI (JP)
International Classes:
B21D7/04; B21D39/02
Foreign References:
JP2007014973A2007-01-25
JP2006263872A2006-10-05
JPH03111415U1991-11-14
JP2001286953A2001-10-16
JP2005103642A2005-04-21
Attorney, Agent or Firm:
MAEDA, Hiroshi et al. (JP)
Hiroshi Maeda (JP)
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Claims: