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Title:
MACHINING METHOD IN WHICH LASER BLANKING DEVICE IS USED
Document Type and Number:
WIPO Patent Application WO/2019/003381
Kind Code:
A1
Abstract:
[Problem] To provide a machining method in which a laser blanking device having exceptional productivity is used, the method enabling high-precision machining even of complex shapes. [Solution] The present invention is a machining method in which a laser blanking device 10 is used, the method involving causing a laser nozzle N to move forward/rearward/leftward/rightward while transporting a flat plate X, cutting the plate X by laser light emitted downward from the laser nozzle N, and obtaining a processed product P, wherein the machining method by the laser blanking device 10 comprises a first step S1 for setting a plurality of coordinates on a trajectory through which the laser nozzle N is to pass in order to cut the plate X while the plate X is stopped and obtain the processed product P, a second step S2 for setting an overall machining time in which the laser nozzle N moves at the maximum nozzle movement speed between adjacent coordinates, a third step S4 for setting the feeding speed of the plate X from the plate feeding distance required to machine the processed product P and the machining time, a fourth step S6 for moving the coordinates along the longitudinal direction of the plate and resetting the nozzle movement speed in consideration of the set feeding speed, and a fifth step S7 in which machining is performed on the basis of the reset coordinates and nozzle movement speed.

Inventors:
IGARASHI HIROTAKA (JP)
OTANI MASAYA (JP)
IWANAGA TOSHIYUKI (JP)
Application Number:
PCT/JP2017/023927
Publication Date:
January 03, 2019
Filing Date:
June 29, 2017
Export Citation:
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Assignee:
HITACHI ZOSEN FUKUI CORP (JP)
International Classes:
B23K26/08
Foreign References:
JP2011512259A2011-04-21
JP2004042119A2004-02-12
JPH0760467A1995-03-07
JPH06170570A1994-06-21
Attorney, Agent or Firm:
SHIRASAKI Shinji (JP)
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