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Title:
MACHINING PROCESS FOR MOLD CAVITY OF SEMICONDUCTOR PACKAGING MOLD
Document Type and Number:
WIPO Patent Application WO/2019/109659
Kind Code:
A1
Abstract:
A machining process for a mold cavity of a semiconductor packaging mold specifically comprises: mill roughing, CNC roughing, heat treatment, grinder roughing, grinder semi-finishing, CNC semi-finishing, CNC finishing, grinder finishing, and after treatment.

Inventors:
WANG, Dexiao (1 Floor, 10 Tower Langshan Industrial Park, 30 Purple Lang Road, Nantong Jiangsu 0, 226000, CN)
BEN, Chunxiang (1 Floor, 10 Tower Langshan Industrial Park, 30 Purple Lang Road, Nantong Jiangsu 0, 226000, CN)
LIU, Peng (1 Floor, 10 Tower Langshan Industrial Park, 30 Purple Lang Road, Nantong Jiangsu 0, 226000, CN)
Application Number:
CN2018/099964
Publication Date:
June 13, 2019
Filing Date:
August 10, 2018
Export Citation:
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Assignee:
NANTONG SAMER PRECISION EQUIPMENT CO., LTD. (1 Floor, 10 Tower Langshan Industrial Park, 30 Purple Lang Road, Nantong Jiangsu 0, 226000, CN)
International Classes:
B23P15/24
Foreign References:
CN108161380A2018-06-15
CN105215644A2016-01-06
CN106141590A2016-11-23
US20020109248A12002-08-15
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