Title:
MACHINING SWARF REMOVING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2017/158995
Kind Code:
A1
Abstract:
This machining swarf removing apparatus 7 is provided with a left machining swarf removing unit 25 and a right machining swarf removing unit 26. When removing machining swarf adhered to a recovery box 6, the left machining swarf removing unit 25 is set at a removal starting position. When doing so, a brush 32 is in an insertion-ready state in which the short direction thereof is oriented in a second direction D2. After moving the brush 32 to an insertion position for insertion into the recovery box 6, the brush 32 is rotated so as to be brought into a state ready for removing machining swarf in which the long direction thereof is oriented in the second direction D2, and while the brush is in that state, the left machining swarf removing part 25 is moved to remove the swarf adhered to the recovery box 6 using the brush 32. While doing so, a left rod vibrating device 43 is driven to vibrate a rod 33, which in turn causes the brush 32 mounted on the rod 33 to vibrate.
Inventors:
HIRATA YUICHI (JP)
AGO SHINJI (JP)
SATO TAKANORI (JP)
SATO YUKI (JP)
AGO SHINJI (JP)
SATO TAKANORI (JP)
SATO YUKI (JP)
Application Number:
PCT/JP2016/089056
Publication Date:
September 21, 2017
Filing Date:
December 28, 2016
Export Citation:
Assignee:
HONDA MOTOR CO LTD (JP)
International Classes:
B08B1/00; B23K26/16; B23K26/00; B23K26/38; B23K26/70; B23Q11/00
Foreign References:
| JP2016034650A | 2016-03-17 | |||
| JP2004209534A | 2004-07-29 | |||
| JPH10151719A | 1998-06-09 |
Attorney, Agent or Firm:
SATO & ASSOCIATES (JP)
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