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Title:
MAGNESIUM-BASED ALLOY WROUGHT PRODUCT AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2019/017307
Kind Code:
A1
Abstract:
Provided is a Mg-based alloy wrought product having improved ductility, formability, and fracture resistance. Conventional additive elements tend to bond to each other to form intermetallic compounds and can act as fracture initiation points. Using inexpensive and general purpose elements, we discovered additive elements that do not act as fracture initiation points and exhibit a grain boundary sliding promoting effect while maintaining a microstructure that activates non-bottom surface dislocation movement in a Mg-based alloy wrought product. This Mg-based alloy wrought product contains at least one among Zr, Bi, and Sn, and at least one among Al, Zn, Ca, Li, Y, and Gd, with the remainder comprising Mg and inevitable impurities, wherein the average grain size of a base material is 20 μm or less, and the grain size of a Mg parent phase is refined during room temperature deformation. In a stress-strain curve obtained from a tension and compression test of the wrought product, the relationship between maximum load stress (σmax) and stress at break (σbk), that is, the value of (σmax-σbk)/σmax is at least 0.2, and the fracture resistance is at least 100 kJ.

Inventors:
SOMEKAWA HIDETOSHI (JP)
OSAWA YOSHIAKI (JP)
Application Number:
PCT/JP2018/026588
Publication Date:
January 24, 2019
Filing Date:
July 13, 2018
Export Citation:
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Assignee:
NAT INST MATERIALS SCIENCE (JP)
International Classes:
C22C23/00; C22C23/06; C22F1/06; C22F1/00
Domestic Patent References:
WO2017154969A12017-09-14
WO2013180122A12013-12-05
Foreign References:
US20140332121A12014-11-13
CN106521272A2017-03-22
CN106544563A2017-03-29
JP2010070839A2010-04-02
JP2017078220A2017-04-27
JP2008214668A2008-09-18
JP2006016658A2006-01-19
JP2016017183A2016-02-01
JP2016089228A2016-05-23
JP2003328065A2003-11-19
Other References:
See also references of EP 3656884A4
Attorney, Agent or Firm:
AIKAWA, Toshihiko (JP)
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