Title:
MAGNETIC BOARD MANUFACTURING METHOD AND MAGNETIC BOARD
Document Type and Number:
WIPO Patent Application WO/2024/048283
Kind Code:
A1
Abstract:
This method for manufacturing a magnetic board, which comprises a magnetic layer and a conductor layer formed on a surface of the magnetic layer, includes a step (EP) of forming the conductor layer on the surface of the magnetic layer by means of electroplating. The magnetic layer includes a curing material that is a resin composition including (A) magnetic powder and (B) thermosetting resin. The (A) magnetic powder includes (A-1) alloy powder the mass percentage of which is equal to or greater than 30% relative to the (A) magnetic powder the mass percentage of which is 100%.
Inventors:
TANAKA TAKAYUKI (JP)
MORIMOTO SHUNSUKE (JP)
HOMMA TATSUYA (JP)
OOYAMA HIDEKI (JP)
MORIMOTO SHUNSUKE (JP)
HOMMA TATSUYA (JP)
OOYAMA HIDEKI (JP)
Application Number:
PCT/JP2023/029610
Publication Date:
March 07, 2024
Filing Date:
August 16, 2023
Export Citation:
Assignee:
AJINOMOTO KK (JP)
International Classes:
H05K1/16; B32B15/08; H01F1/26
Foreign References:
| JP2019220504A | 2019-12-26 | |||
| JP2021158316A | 2021-10-07 | |||
| JP2022025342A | 2022-02-10 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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