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Patent Searching and Data


Title:
MAGNETIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/141668
Kind Code:
A1
Abstract:
This magnetic device (1) is provided with the following: a magnetic core (2a); an insulating substrate (3) through which protrusions (2m, 2L, 2r) on the core (2a) pass; and a conductor provided on the substrate (3). Said conductor contains coil patterns (4a, 4b, 4c, 4d, 4e), which wind around the aforementioned protrusions (2m, 2L, 2r), and heat-dissipating patterns (5a, 5b, 5c, 5d, 5e). A heat sink is provided on the bottom of the substrate (3), and the conductor surface area on a top-surface layer (L1) of the substrate (3) is made larger than the conductor surface area on a bottom-surface layer (L3) of the substrate (3).

Inventors:
FURUI, Shusuke (2254-28, Kiribayashi, Iida-sh, Nagano 65, 〒3992565, JP)
TAKEUCHI, Toshiyuki (2254-28, Kiribayashi, Iida-sh, Nagano 65, 〒3992565, JP)
Application Number:
JP2014/001319
Publication Date:
September 18, 2014
Filing Date:
March 10, 2014
Export Citation:
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Assignee:
OMRON AUTOMOTIVE ELECTRONICS CO., LTD. (6368, Nenjozaka Okusa, Komaki-sh, Aichi 02, 〒4850802, JP)
International Classes:
H01F37/00; H01F17/00; H01F17/04; H01F27/08; H01F27/22; H01F27/28; H05K1/02
Domestic Patent References:
WO2011010491A12011-01-27
Foreign References:
JP2010161258A2010-07-22
JP2007059839A2007-03-08
JP2010153724A2010-07-08
JP2008502293A2008-01-24
JP2013062355A2013-04-04
Attorney, Agent or Firm:
OKUMURA, Hideyuki (Shin-osaka NO.8 Bldg. 4F 5-7-11, Nishinakajima, Yodogawa-ku, Osaka-sh, Osaka 11, 〒5320011, JP)
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