Title:
MAGNETIC-FIELD MELTING SOLDER, AND JOINING METHOD IN WHICH SAME IS USED
Document Type and Number:
WIPO Patent Application WO/2021/106720
Kind Code:
A1
Abstract:
Provided is a magnetic-field melting solder that melts due to the action of an AC magnetic field. The magnetic-field melting solder contains a solder material, and a magnetic-body material in a proportion of 0.005-20 mass% relative to the entirety of the magnetic-field melting solder. The upper limit of this proportion is preferably 5 mass%, and even more preferably 0.9 mass%. According to the present invention, a joining method in which the magnetic-field melting solder is used comprises: a step for providing the magnetic-field melting solder between an electrode on a substrate and an electrode in an electronic component; and a step for melting the magnetic-field melting solder by generating an AC magnetic field in the periphery of the substrate, thereby joining the electrode on the substrate and the electrode in the electronic component.
More Like This:
Inventors:
SAKUMA HARUYA (JP)
TOMITSUKA KENICHI (JP)
YOSHIDA HISAHIKO (JP)
KANAZAWA KENJI (JP)
UEMURA SEI (JP)
NAKAMURA TAKASHI (JP)
NISHIOKA MASATERU (JP)
TOMITSUKA KENICHI (JP)
YOSHIDA HISAHIKO (JP)
KANAZAWA KENJI (JP)
UEMURA SEI (JP)
NAKAMURA TAKASHI (JP)
NISHIOKA MASATERU (JP)
Application Number:
PCT/JP2020/043050
Publication Date:
June 03, 2021
Filing Date:
November 18, 2020
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
AIST (JP)
AIST (JP)
International Classes:
B23K35/22; B23K1/00; B23K1/002; B23K35/14; B23K35/26; H05K3/34
Foreign References:
| JP2849208B2 | 1999-01-20 | |||
| JPH0846353A | 1996-02-16 | |||
| US5573859A | 1996-11-12 | |||
| CN108608130A | 2018-10-02 | |||
| JPH1147977A | 1999-02-23 | |||
| US20070246514A1 | 2007-10-25 | |||
| JP2017213581A | 2017-12-07 | |||
| US20110210283A1 | 2011-09-01 |
Attorney, Agent or Firm:
TAKADA, TAKAHASHI & PARTNERS (JP)
Download PDF: