Title:
MAGNETIC FIELD SENSOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2015/026167
Kind Code:
A1
Abstract:
A magnetic field sensor package according to an embodiment comprises: a package body; a magnetic field sensor disposed on top of the package body and including a sensor assembly in which a displacement is generated by a magnetic field; and a conductive line formed on the package body, which is for making a current to be measured flow and generating a magnetic field for displacing the sensor assembly, wherein the conductive line generates a magnetic field applied in a perpendicular direction to the sensor assembly.
Inventors:
SEO SANG WON (KR)
SEO JEONG GI (KR)
KIM CHUL (KR)
KO YONG JUN (KR)
CHOI WAN SEOP (KR)
SEO JEONG GI (KR)
KIM CHUL (KR)
KO YONG JUN (KR)
CHOI WAN SEOP (KR)
Application Number:
PCT/KR2014/007746
Publication Date:
February 26, 2015
Filing Date:
August 21, 2014
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
G01R33/02; G01R33/06
Foreign References:
US20050270014A1 | 2005-12-08 | |||
JP2013011469A | 2013-01-17 | |||
US20120086433A1 | 2012-04-12 | |||
US20090033314A1 | 2009-02-05 | |||
US20100134101A1 | 2010-06-03 |
Attorney, Agent or Firm:
SEO, Kyo Jun (KR)
서교준 (KR)
서교준 (KR)
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