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Title:
MAGNETIC POLISHING PAD AND PLATEN STRUCTURES FOR CHEMICAL MECHANICAL POLISHING
Document Type and Number:
WIPO Patent Application WO/2019/139586
Kind Code:
A1
Abstract:
Disclosed herein are chemical mechanical polishing (CMP) polishing pad and platen structures, and related systems and techniques. For example, in some embodiments, a CMP conditioning system may include a CMP polishing pad structure and a CMP platen structure, wherein the CMP polishing pad structure is magnetically coupled to the CMP platen structure.

Inventors:
TREGUB ALEXANDER (US)
Application Number:
PCT/US2018/013252
Publication Date:
July 18, 2019
Filing Date:
January 11, 2018
Export Citation:
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Assignee:
INTEL CORP (US)
International Classes:
B24B37/24; B24B37/14; H01L21/306
Foreign References:
US20060286906A12006-12-21
US8845398B22014-09-30
US20040072518A12004-04-15
US20150126095A12015-05-07
EP2025454A22009-02-18
Attorney, Agent or Firm:
ZAGER, Laura, A. (US)
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