Title:
MAGNETIC SENSOR AND MAGNETIC SENSOR DEVICE, AND MAGNETIC SENSOR MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/091714
Kind Code:
A1
Abstract:
The present invention is provided with the following: a pellet (10); a plurality of lead terminals (22)-(25) disposed on the periphery of the pellet (10); a plurality of thin metal wires (31)-(34) that electrically connect a plurality of electrode parts of the pellet (10) and each of the lead terminals (22)-(25) respectively; an insulative paste (40) that covers the rear surface of the pellet (10); and a molded resin (50) that covers the pellet (10) and the plurality of thin metal wires (31)-(34). At least a portion of the insulative paste (40) and at least a portion of the rear surfaces of the lead terminals (22)-(25) are exposed from the molded resin (50).
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Inventors:
FUKUNAKA TOSHIAKI (JP)
HASEGAWA HIDENORI (JP)
HASEGAWA HIDENORI (JP)
Application Number:
PCT/JP2013/007097
Publication Date:
June 19, 2014
Filing Date:
December 03, 2013
Export Citation:
Assignee:
ASAHI KASEI MICRODEVICES CORP (JP)
International Classes:
H01L43/04; G01R33/07; H01L21/52; H01L23/50
Domestic Patent References:
| WO2010090075A1 | 2010-08-12 |
Foreign References:
| JPH01124273A | 1989-05-17 | |||
| JP2003243646A | 2003-08-29 | |||
| JP2005123383A | 2005-05-12 | |||
| JP2005294443A | 2005-10-20 | |||
| JP2009049253A | 2009-03-05 |
Attorney, Agent or Firm:
MORI, Tetsuya et al. (JP)
Woods Tetsuya (JP)
Woods Tetsuya (JP)
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