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Patent Searching and Data

Document Type and Number:
WIPO Patent Application WO/2017/208753
Kind Code:
The purpose of the present invention is to reduce the risk of unstable grounding between a sensor core and an electroconductive member that grounds the sensor core. This magnetic sensor device 1 grounds the sensor core 32 via the electroconductive member 20 mounted to a frame 11 that holds a magnetic sensor element 12. The direction (-X direction) in which the electroconductive member 20 is mounted to the frame 11 intersects with the contact direction (+Z direction) in which the flat spring 22 of the electroconductive member 20 comes into contact with the sensor core 32. The conductive member 20 comprises a mounting part 21 that extends in a direction along the core surface 32b of the sensor core 32, and a flat spring 22 that is connected to the mounting part 21 via a bent part 27. The flat spring 22 comes into contact with the edge of the sensor core 32 that is exposed at the tip of the core body 33 that protrudes from the bottom of the frame 11. The mounting part 21 has formed therein a retaining hole 24 into which a holding part 90 which protrudes from the frame 11 is fitted.

MOCHIDA, Tetsuo (5329 Shimosuwa-machi, Suwa-gu, Nagano 11, 〒3938511, JP)
Application Number:
Publication Date:
December 07, 2017
Filing Date:
May 10, 2017
Export Citation:
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NIDEC SANKYO CORPORATION (5329, Shimosuwa-machi Suwa-gu, Nagano 11, 〒3938511, JP)
International Classes:
G01R33/02; G07D7/00; G07D7/04
Domestic Patent References:
Foreign References:
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