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Title:
MAGNETIC SENSOR MODULE
Document Type and Number:
WIPO Patent Application WO/2019/131816
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a magnetic sensor module in which the impact on a magnetic sensor of heat generated from a coil is reduced. According to a conventional method, a plurality of temperature measuring circuit are required corresponding to a plurality of magnetic sensors on a magnetic sensor chip, and a large number of pads for connecting the magnetic sensor chip to an IC chip are also required. There have consequently been problems in terms of an increase in the size of the magnetic sensor chip on which the magnetic sensors are mounted, and an increase in manufacturing cost. The present invention provides a magnetic sensor module provided with: an IC chip including a first coil, a first pad connected to one end of the first coil, and a second pad connected to the other end of the first coil; a magnetic sensor chip which is disposed on a surface of the IC chip and includes a first magnetic sensor for detecting magnetism in a first axial direction; a first external output terminal; a first conducting wire connecting the first pad and the first external output terminal; a second external output terminal; and a second conducting wire connecting the second pad and the second external output terminal.

Inventors:
YOSHIDA MASANORI (JP)
OKUTSU YOSHITAKA (JP)
ISHIDA KAZUHIRO (JP)
WATANABE KAZUYA (JP)
HIRABAYASHI HIRAKU (JP)
SAKAI MASANORI (JP)
Application Number:
PCT/JP2018/047987
Publication Date:
July 04, 2019
Filing Date:
December 26, 2018
Export Citation:
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Assignee:
ASAHI KASEI MICRODEVICES CORP (JP)
TDK CORP (JP)
International Classes:
G01R33/02; G01R33/09; G01R35/00; H01L43/02; H01L43/08
Domestic Patent References:
WO2016021260A12016-02-11
Foreign References:
JP2003202365A2003-07-18
JP2004055932A2004-02-19
JP2007218799A2007-08-30
JP2007292692A2007-11-08
JP2007026807A2007-02-01
Attorney, Agent or Firm:
RYUKA IP LAW FIRM (JP)
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