Title:
MAGNETIC SENSOR
Document Type and Number:
WIPO Patent Application WO/2020/137861
Kind Code:
A1
Abstract:
[Problem] To provide a magnetic sensor capable of reducing 1/f noise by mechanically displacing a magnetic path, without using an MEMS structure requiring a high temperature process. [Solution] This magnetic sensor 1 comprises: a sensor chip 10 that has an element formation surface 11 on which a magnetosensitive element R1 is provided; a magnetism collecting member 24 that is provided separately from the sensor chip 10, and that gives to the magnetosensitive element R1 a magnetic flux that is the detection target; and a piezoelectric structure P that displaces the plane position on the element formation surface of a tip 24a of the magnetism collecting member 24. With this configuration, unlike the MEMS structure, since there is a structure by which the tip of the magnetism collecting member provided separately from the sensor chip is displaced by a drive unit, it is not necessary to perform the high temperature process after formation of the magnetosensitive element. This makes it possible to reduce 1/f noise while preventing characteristic deterioration of the magnetosensitive element due to the high temperature process.
Inventors:
FUKUI TAKATO (JP)
KASAJIMA TAMON (JP)
KASAJIMA TAMON (JP)
Application Number:
PCT/JP2019/050049
Publication Date:
July 02, 2020
Filing Date:
December 20, 2019
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
H01L43/08; G01R33/02; G01R33/09; H01L41/09; H01L41/187
Domestic Patent References:
WO2017082011A1 | 2017-05-18 | |||
WO2018190261A1 | 2018-10-18 | |||
WO2017204151A1 | 2017-11-30 |
Foreign References:
US20120206134A1 | 2012-08-16 | |||
JP2016183944A | 2016-10-20 | |||
JPS54178873U | 1979-12-18 | |||
JP2019174140A | 2019-10-10 |
Attorney, Agent or Firm:
WASHIZU Mitsuhiro et al. (JP)
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