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Patent Searching and Data


Title:
MAGNETIC WIRING CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2019/176152
Kind Code:
A1
Abstract:
This magnetic wiring circuit board is provided with: an insulation layer; a wiring that is disposed on one surface, in the thickness direction, of the insulation layer and that includes one thickness-wise surface disposed so as to be opposite to and at a distance from the one surface, in the thickness direction, of the insulation layer, the other thickness-wise surface contacting the one surface, in the thickness direction, of the insulation layer, and lateral surfaces connecting both edges of the one thickness-wise surface and the other thickness-wise surface; and a magnetic layer that contains magnetic particles each having a shape, the aspect ratio of which is 2 or more, and that has embedded therein the wiring. The wiring includes: first corner sections that are formed by the one thickness-wise surface and the lateral surfaces and that each have an approximately curved shape; and second corner sections that are formed by the other thickness-wise surface and the lateral surfaces and that form sections with which the length between the two lateral surfaces facing each other increases toward the other thickness-wise surface.

Inventors:
OKUMURA, Keisuke (1-2 Shimo-hozumi 1-chome, Ibaraki-sh, Osaka 80, 〒5678680, JP)
FURUKAWA, Yoshihiro (1-2 Shimo-hozumi 1-chome, Ibaraki-sh, Osaka 80, 〒5678680, JP)
Application Number:
JP2018/039082
Publication Date:
September 19, 2019
Filing Date:
October 19, 2018
Export Citation:
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Assignee:
NITTO DENKO CORPORATION (1-2 Shimo-hozumi 1-chome, Ibaraki-shi Osaka, 80, 〒5678680, JP)
International Classes:
H01F17/04; H01F17/00; H01F38/14; H01F41/04
Domestic Patent References:
WO2017090950A12017-06-01
Foreign References:
JP2009009985A2009-01-15
JP2009117721A2009-05-28
US20160343498A12016-11-24
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (Central Shin-Osaka Building 3rd Floor 5-36, Miyahara 4-chome, Yodogawa-ku, Osaka-sh, Osaka 03, 〒5320003, JP)
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