Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MAGNETIC WIRING CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2019/177077
Kind Code:
A1
Abstract:
A method for manufacturing a magnetic wiring circuit board, the method being provided with: a sandwiching step for sandwiching, between two press plates, an insulation layer, a plurality of wiring parts disposed at a distance from each other in a prescribed direction on one thickness-direction surface of the insulation layer, a first magnetic sheet, and a release cushion sheet in the stated order; and a first pressing step for heat-pressing the insulation layer, the plurality of wiring parts, the first magnetic sheet, and the release cushion sheet using the press plates. In the first pressing step, a first magnetic layer is formed so as to fill the gaps between the plurality of wiring parts and cover one thickness-direction surface of the wiring parts from the first magnetic sheet. The release cushion sheet is provided with a first layer and a second layer disposed on one thickness-direction side of the first layer. The tensile storage elasticity modulus E' of the second layer at 110°C is lower than the tensile storage elasticity modulus E' of the first layer at 110°C.

Inventors:
FURUKAWA, Yoshihiro (1-2 Shimo-hozumi 1-chome, Ibaraki-sh, Osaka 80, 〒5678680, JP)
OKUMURA, Keisuke (1-2 Shimo-hozumi 1-chome, Ibaraki-sh, Osaka 80, 〒5678680, JP)
Application Number:
JP2019/010447
Publication Date:
September 19, 2019
Filing Date:
March 14, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NITTO DENKO CORPORATION (1-2 Shimo-hozumi 1-chome, Ibaraki-shi Osaka, 80, 〒5678680, JP)
International Classes:
H01F41/04; H01F17/00; H01F17/04; H05K1/16
Domestic Patent References:
WO2014192427A12014-12-04
Foreign References:
JPH1074626A1998-03-17
JPH1154327A1999-02-26
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (Central Shin-Osaka Building 3rd Floor 5-36, Miyahara 4-chome, Yodogawa-ku, Osaka-sh, Osaka 03, 〒5320003, JP)
Download PDF: