MAGNETIC WIRING CIRCUIT BOARD

Title:

MAGNETIC WIRING CIRCUIT BOARD

Document Type and Number:

WIPO Patent Application WO/2019/198569

Kind Code:

A1

Abstract:

This magnetic wiring circuit board is provided with: an insulating layer; a plurality of wiring portions which are disposed on one surface in a thickness direction of the insulating layer and at an interval from each other in an orthogonal direction orthogonal to the thickness direction; a magnetic layer disposed on the one surface in the thickness direction of the insulating layer in such a way that the plurality of wiring portions are buried, wherein one surface in the thickness direction of the magnetic layer is disposed at an interval on one side in the thickness direction with respect to one surface in the thickness direction of the plurality of wiring portions; and a suppression portion which is formed in the magnetic layer between at least two wiring portions adjacent to each other so as to extend from the one surface in the thickness direction of the magnetic layer toward the other side in the thickness direction beyond at least a virtual line connecting the two wiring portions at the one surface in the thickness direction, the suppression portion suppressing a magnetic coupling of the at least two wiring portions.

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WO/2008/066143	TRANSFORMER DEVICE
JP2002134319	SPIRAL INDUCTOR
WO/2005/008695	INDUCTIVE AND CAPACITIVE ELEMENTS FOR SEMICONDUCTOR TECHNOLOGIES WITH MINIMUM PATTERN DENSITY REQUIREMENTS

Inventors:

FURUKAWA YOSHIHIRO (JP)
OKUMURA KEISUKE (JP)

Application Number:

PCT/JP2019/014644

Publication Date:

October 17, 2019

Filing Date:

April 02, 2019

Export Citation:

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Assignee:

NITTO DENKO CORP (JP)

International Classes:

H01F17/00; B32B15/08; H01F17/04; H05K1/16

Foreign References:

JPH05152130A	1993-06-18
JPH06302436A	1994-10-28
JP2004363291A	2004-12-24
JP2017005115A	2017-01-05
JP2015092543A	2015-05-14

Other References: