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Patent Searching and Data


Title:
MAGNETIC WIRING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2019/198569
Kind Code:
A1
Abstract:
This magnetic wiring circuit board is provided with: an insulating layer; a plurality of wiring portions which are disposed on one surface in a thickness direction of the insulating layer and at an interval from each other in an orthogonal direction orthogonal to the thickness direction; a magnetic layer disposed on the one surface in the thickness direction of the insulating layer in such a way that the plurality of wiring portions are buried, wherein one surface in the thickness direction of the magnetic layer is disposed at an interval on one side in the thickness direction with respect to one surface in the thickness direction of the plurality of wiring portions; and a suppression portion which is formed in the magnetic layer between at least two wiring portions adjacent to each other so as to extend from the one surface in the thickness direction of the magnetic layer toward the other side in the thickness direction beyond at least a virtual line connecting the two wiring portions at the one surface in the thickness direction, the suppression portion suppressing a magnetic coupling of the at least two wiring portions.

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Inventors:
FURUKAWA, Yoshihiro (1-2 Shimo-hozumi 1-chome, Ibaraki-sh, Osaka 80, 〒5678680, JP)
OKUMURA, Keisuke (1-2 Shimo-hozumi 1-chome, Ibaraki-sh, Osaka 80, 〒5678680, JP)
Application Number:
JP2019/014644
Publication Date:
October 17, 2019
Filing Date:
April 02, 2019
Export Citation:
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Assignee:
NITTO DENKO CORPORATION (1-2 Shimo-hozumi 1-chome, Ibaraki-shi Osaka, 80, 〒5678680, JP)
International Classes:
H01F17/00; B32B15/08; H01F17/04; H05K1/16
Foreign References:
JPH05152130A1993-06-18
JPH06302436A1994-10-28
JP2004363291A2004-12-24
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (Central Shin-Osaka Building 3rd Floor 5-36, Miyahara 4-chome, Yodogawa-ku, Osaka-sh, Osaka 03, 〒5320003, JP)
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