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Title:
MAGNETICALLY SEALED WAFER PLATING JIG SYSTEM AND METHOD
Document Type and Number:
WIPO Patent Application WO/2014/018084
Kind Code:
A3
Abstract:
A wafer plating jig system comprising an electrically insulating wafer plating jig base having a plurality of overlapping cavities of different depths, each cavity configured to receive a semiconductor wafer of a different size and an electrically conductive cover plate comprising an open center surrounded by a support, the cover plate comprising an electrical conductor surrounding the open center and with at least one of the overlapping cavities of the wafer plating jig base.

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Inventors:
SCANLAN CHRISTOPHER (US)
ALDAS FERDINAND (PH)
BLAISDELL KENNETH (US)
ABANES CHERYL (PH)
Application Number:
PCT/US2012/071393
Publication Date:
June 18, 2015
Filing Date:
December 21, 2012
Export Citation:
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Assignee:
CYPRESS SEMICONDUCTOR CORP (US)
SCANLAN CHRISTOPHER (US)
ALDAS FERDINAND (PH)
BLAISDELL KENNETH (US)
ABANES CHERYL (PH)
International Classes:
C25D17/08
Foreign References:
US7780824B22010-08-24
US20090245983A12009-10-01
US7331780B22008-02-19
US20050101138A12005-05-12
US20090233429A12009-09-17
US2505531A1950-04-25
JPS61156840A1986-07-16
US4378189A1983-03-29
US7223162B22007-05-29
US5556814A1996-09-17
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