Title:
MAINTENANCE METHOD FOR PLATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/119347
Kind Code:
A1
Abstract:
Provided is a technology with which it is possible to inhibit deformation of a film disposed inside of a plating tank. This maintenance method for a plating device includes: returning an anolyte in an anodic chamber to an anolyte tank and then circulating the anolyte between the anolyte tank and the anodic chamber (step S10e); and returning a catholyte in a cathodic chamber to a catholyte tank and then circulating the catholyte between the catholyte tank and the cathodic chamber after the circulation of the anolyte between the anolyte tank and the anodic chamber has been initiated (step S10f).
Inventors:
TOMITA MASAKI (JP)
Application Number:
PCT/JP2021/046934
Publication Date:
June 29, 2023
Filing Date:
December 20, 2021
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
C25D21/10; C25D17/00
Foreign References:
| US20150068911A1 | 2015-03-12 | |||
| JP2007291419A | 2007-11-08 | |||
| JP2016117918A | 2016-06-30 | |||
| JP2002220698A | 2002-08-09 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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