MAKE BREAK CONTACT MATERIAL COMPRISING AG-NI BASED ALLOY HAVING NI METAL PARTICLES DISPERSED AND RELAY USING THE SAME

WIPO Patent Application WO/2002/008481

A1

A make and break contact material comprising a Ag-Ni based alloy having Ni metal particles dispersed for use in a make and break part for practicing electrical make and break by mechanical open and close operations, characterized in that it is prepared by admixing 3.1 to 20.0 wt % of a Ni powder, 0.01 to 0.50 wt % in terms of Li of a Li¿2?CO¿3? powder and the balanced amount of a Ag powder, followed by agitating, to form a homogeneously dispersed admixture, and subjecting the admixture to a forming treatment and a sintering treatment. The make and break contact material is reduced in consumption and can be used for manufacturing a miniaturized relay having a prolonged useful life as compared to that of a relay using a conventional Ag-CdO based material, in the field of an AC general purpose relay to be used at a resistance load of 1 to 20 A or so in the range of AC 100V to 250 V.

SAKAGUCHI OSAMU (JP)
TANEICHI KENGO (JP)
YAMAMOTO TOSHIYA (JP)

PCT/JP2001/006219

January 31, 2002

July 18, 2001

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TANAKA PRECIOUS METAL IND (JP)
SAKAGUCHI OSAMU (JP)
TANEICHI KENGO (JP)
YAMAMOTO TOSHIYA (JP)

C22C1/04; C22C1/10; C22C5/06; C22C32/00; H01H1/023; H01H11/04; (IPC1-7): C22C32/00; H01H1/02; H01H50/54

JPS5681649A	1981-07-03
US4502899A	1985-03-05
JPS5213689A	1977-02-02
JPS5893849A	1983-06-03
JPH0371522A	1991-03-27
JPS61246337A	1986-11-01

Tanaka, Daisuke (15-2 Hongo 1-chome Bunkyo-ku, Tokyo, JP)

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