Title:
MAKING MULTILAYER 3D CAPACITORS USING ARRAYS OF UPSTANDING RODS OR RIDGES
Document Type and Number:
WIPO Patent Application WO/2015/192096
Kind Code:
A3
Abstract:
In one embodiment, a method for making a 3D Metal-Insulator-Metal (MIM) capacitor includes providing a substrate (100) having a surface (106), forming an array of upstanding rods or ridges (102) on the surface, depositing a first layer (110) of an electroconductor on the surface and the array of rods or ridges, coating the first electroconductive layer with a layer of a dielectric (112), and depositing a second layer of an electroconductor (118) on the dielectric layer. In some embodiments, the array of rods or ridges can be made of a photoresist material, and in others, can comprise bonded wires.
Inventors:
WANG LIANG (US)
KATKAR RAJESH (US)
SHEN HONG (US)
UZOH CYPRIAN EMEKA (US)
KATKAR RAJESH (US)
SHEN HONG (US)
UZOH CYPRIAN EMEKA (US)
Application Number:
PCT/US2015/035688
Publication Date:
June 09, 2016
Filing Date:
June 12, 2015
Export Citation:
Assignee:
INVENSAS CORP (US)
International Classes:
H01L49/02
Foreign References:
| US20140092524A1 | 2014-04-03 |
Other References:
YONG WANG ET AL: "Recent development of high energy density polymers for dielectric capacitors", IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, IEEE SERVICE CENTER, PISCATAWAY, NJ, US, vol. 17, no. 4, August 2010 (2010-08-01), pages 1036 - 1042, XP011316143, ISSN: 1070-9878
Attorney, Agent or Firm:
LATTIN, Christopher, W. (3025 Orchard ParkwaySan Jose, CA, US)
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