Title:
MALEIMIDE RESIN, ASYMMETRIC BISMALEIMIDE COMPOUND, CURABLE COMPOSITION, CURED OBJECT, SEMICONDUCTOR-ENCAPSULATING MATERIAL, SEMICONDUCTOR-ENCAPSULATING DEVICE, PREPREG, CIRCUIT BOARD, AND BUILD-UP FILM
Document Type and Number:
WIPO Patent Application WO/2022/137913
Kind Code:
A1
Abstract:
The present invention provides: a maleimide resin and a maleimide compound which are characterized by being a product of maleimidization of a polyamine compound (C) which is a product of reaction between a plurality of aromatic monoamine compounds (A) and a binder (B); a curable composition containing either of these; a cured object formed from the curable composition; a semiconductor-encapsulating material; a semiconductor-encapsulating device; a prepreg; a circuit board; and a build-up film. The maleimide resin and the maleimide compound not only are low in melting point and softening point and have excellent handleability, but also give cured objects having high heat resistance and are suitable for use as or in semiconductor-encapsulating materials, etc.
Inventors:
SHIMONO TOMOHIRO (JP)
HAYASHIBARA HITOMI (JP)
OTAGURO TSUNEYUKI (JP)
HAYASHIBARA HITOMI (JP)
OTAGURO TSUNEYUKI (JP)
Application Number:
PCT/JP2021/042356
Publication Date:
June 30, 2022
Filing Date:
November 18, 2021
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C07D207/448; C08F22/40; C08G12/08; H01L23/29; H01L23/31
Domestic Patent References:
| WO2020217679A1 | 2020-10-29 |
Foreign References:
| JPH0431464A | 1992-02-03 | |||
| JPS5130290A | 1976-03-15 | |||
| JPS52125161A | 1977-10-20 | |||
| KR20150002953A | 2015-01-08 | |||
| JPH02300223A | 1990-12-12 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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