Title:
MALEIMIDE RESIN COMPOSITION, PREPREG, CURED PRODUCT OF SAME AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/025921
Kind Code:
A1
Abstract:
Provided is a maleimide resin composition which contains a maleimide compound and a sulfonyl compound having a structure represented by formula AA, and which is able to be cured by a curing process equivalent to that of an epoxy resin, while achieving moldability (curability) at 200°C or less, heat resistance of 250°C or more, retention of high thermal stability and high elastic modulus at 250°C, low dielectric constant and low dielectric loss tangent. (In formula AA, each R represents an alkenyl group, an alkenyl ether group, a hydrogen atom, a halogen atom, a C1-10 alkyl group, a C1-4 fluoroalkyl group, a hydroxy group, an allyloxy group, an amino group, a cyano group, a nitro group, an acyl group, an acyloxy group, a carboxy group, a tertiary carbon-containing group, a cyclic alkyl group or a glycidyl group (provided that at least one R moiety represents an alkenyl group or an alkenyl ether group); and a represents a number of 1-4.)
Inventors:
MATSUURA KAZUKI (JP)
NAKANISHI MASATAKA (JP)
KUBOKI KENICHI (JP)
NAKANISHI MASATAKA (JP)
KUBOKI KENICHI (JP)
Application Number:
PCT/JP2017/028091
Publication Date:
February 08, 2018
Filing Date:
August 02, 2017
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08L79/08; C08J5/24; C08K5/41
Foreign References:
| CN104861652A | 2015-08-26 | |||
| CN104877134A | 2015-09-02 | |||
| CN102276837A | 2011-12-14 | |||
| CN101613531A | 2009-12-30 | |||
| JPS6250312A | 1987-03-05 | |||
| JPH01306405A | 1989-12-11 |
Attorney, Agent or Firm:
SHIN-EI PATENT FIRM, P.C. (JP)
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