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Title:
MALEIMIDE RESIN COMPOSITION, PREPREG, LAMINATED BOARD, RESIN FILM, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2020/262537
Kind Code:
A1
Abstract:
The present invention relates to a maleimide resin composition which contains: (A) one or more selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof; and (B) a modified conjugated diene polymer. Component (B) is a product obtained by modifying a conjugated diene polymer (b1) having a vinyl group in a side chain with a maleimide compound (b2) having two or more N-substituted maleimide groups. The present invention also relates to a prepreg, a laminated board, a resin film, a multilayer printed wiring board and a semiconductor package, which are obtained using the maleimide resin composition.

Inventors:
KASAHARA AYA (JP)
KOTAKE TOMOHIKO (JP)
FUJIMOTO DAISUKE (JP)
Application Number:
PCT/JP2020/025028
Publication Date:
December 30, 2020
Filing Date:
June 25, 2020
Export Citation:
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Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08L15/00; B29B11/16; C08F8/30; C08F36/04; C08J5/04; C08J5/18; C08K5/3415; H05K3/46
Foreign References:
JP2013189644A2013-09-26
JP2014084413A2014-05-12
JPH06192322A1994-07-12
JP2016166261A2016-09-15
JPS5827703A1983-02-18
JP2016135859A2016-07-28
Other References:
See also references of EP 3992239A4
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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