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Patent Searching and Data


Title:
MANIFOLD FLUID MODULE
Document Type and Number:
WIPO Patent Application WO/2023/204473
Kind Code:
A1
Abstract:
The present invention relates to a manifold fluid module. A manifold fluid module according to an embodiment of the present invention may include: a manifold plate having a fluid flow channel formed therein; and a heat exchanger which is coupled to the manifold plate, allows a first fluid and a second fluid to exchange heat, and is provided with a first inlet end through which the first fluid is introduced, a first discharge end through which the first fluid is discharged, a second inlet end through which the second fluid is introduced, and a second discharge end through which the second fluid is discharged, wherein the first inlet end and the first discharge end of the heat exchanger are connected to communicate with the fluid flow path, and one of the first inlet end or the first discharge end is directly connected to the manifold plate and the other thereof is connected to a fluid tube.

Inventors:
LEE KYEONG CHEOL (KR)
KANG IN KEUN (KR)
KIM YOUNG MAN (KR)
KIM IN HYEOK (KR)
LEE JAE MIN (KR)
Application Number:
PCT/KR2023/004260
Publication Date:
October 26, 2023
Filing Date:
March 30, 2023
Export Citation:
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Assignee:
HANON SYSTEMS (KR)
International Classes:
B60H1/32; B60H1/00; F28F9/26
Foreign References:
CN113276630A2021-08-20
KR20210022220A2021-03-03
KR102359325B12022-02-08
US20210086587A12021-03-25
KR102189058B12020-12-09
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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