Title:
MANIPULATION SYSTEM AND FLUID CHIP
Document Type and Number:
WIPO Patent Application WO/2023/210407
Kind Code:
A1
Abstract:
[Problem] To provide technology for facilitating control of the position of a manipulation object. [Solution] Provided is a manipulation system for arranging and manipulating a manipulation object at a prescribed position in a manipulation region containing a liquid. The manipulation system comprises: the manipulation region; first flow paths that are a plurality of flow paths connected to the manipulation region and containing the liquid; a liquid control unit that moves the liquid inside the first flow paths; and second flow paths that are a series of flow paths containing the liquid and that connect to the respective plurality of first flow paths.
Inventors:
UKITA YOSHIAKI (JP)
ABE TAKAAKI (JP)
ABE TAKAAKI (JP)
Application Number:
PCT/JP2023/015165
Publication Date:
November 02, 2023
Filing Date:
April 14, 2023
Export Citation:
Assignee:
UNIV YAMANASHI (JP)
International Classes:
G02B21/32; C12M1/00; G01N37/00
Domestic Patent References:
| WO2015163194A1 | 2015-10-29 | |||
| WO2021186050A1 | 2021-09-23 |
Foreign References:
| JP2021185782A | 2021-12-13 | |||
| JP2006250846A | 2006-09-21 |
Attorney, Agent or Firm:
KNOWLEDGE PARTNERS PPC (JP)
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