Title:
MANUFACTURE OF SOLID STATE ELECTRONIC COMPONENTS
Document Type and Number:
WIPO Patent Application WO2002097832
Kind Code:
A3
Abstract:
The present invention concerns the field of the manufacture of solid state components, and in preferred embodiments, capacitors. The method relates particularly to massed production methods for manufacturing solid state components, such as capacitors. According to one aspect of the present invention there is provided a method of manufacturing multiple solid state electronic components comprising: (i) providing a first substrate (10) provided with a plurality of first solid state electronic component elements (16) formed on a surface thereof, (ii) providing a second substrate (110) provided with a plurality of second solid state electronic component elements formed (116) on a surface thereof, (iii) aligning the first and second substrates so that respective first and second component elements are each mutually aligned, (iv) fixing the first and second substrates together, so that the first and second elements are operatively connected one to another, thereby to form a substrate sandwich, (v) dividing the substrate sandwich to form a plurality of individual components (60, 70), each comprising a first component element (16) operatively connected to a second component element (110). Suitable types of component are capacitors, diodes and resistors, although this list is not exhaustive and other suitable components are available to be made using this method.
Inventors:
HUNTINGTON DAVID (GB)
Application Number:
PCT/GB2002/002466
Publication Date:
November 27, 2003
Filing Date:
May 24, 2002
Export Citation:
Assignee:
AVX LTD (GB)
HUNTINGTON DAVID (GB)
HUNTINGTON DAVID (GB)
International Classes:
H01C17/00; H01G9/26; H01G4/38; H01G9/00; H01G9/032; H01G9/15; H01G13/00; H01G4/012; H01G4/10; H01G; (IPC1-7): H01G9/24; H01G9/00; H01C17/00
Domestic Patent References:
| WO2001011638A1 | 2001-02-15 |
Download PDF: